The N2-plasma treatment on a HfO2 blocking layer of Au nanocrystal nonvolatile memory without any post annealing is investigated. The electrical characteristics of the MOS capacitor with structure of Al–Ta N/HfO2/Si ...The N2-plasma treatment on a HfO2 blocking layer of Au nanocrystal nonvolatile memory without any post annealing is investigated. The electrical characteristics of the MOS capacitor with structure of Al–Ta N/HfO2/Si O2/p-Si are also characterized. After N2-plasma treatment, the nitrogen atoms are incorporated into HfO2 film and may passivate the oxygen vacancy states. The surface roughness of HfO2 film can also be reduced. Those improvements of HfO2 film lead to a smaller hysteresis and lower leakage current density of the MOS capacitor. The N2-plasma is introduced into Au nanocrystal（NC） nonvolatile memory to treat the HfO2 blocking layer. For the N2-plasma treated device, it shows a better retention characteristic and is twice as large in the memory window than that for the no N2-plasma treated device. It can be concluded that the N2-plasma treatment method can be applied to future nonvolatile memory applications.展开更多
In this paper, oxidation of Ge surface by N2O plasma is presented and experimentally demonstrated. Results show that 1.0-nm GeO2 is achieved after 120-s N20 plasma oxidation at 300 ℃. The GeO2/Ge interface is atomica...In this paper, oxidation of Ge surface by N2O plasma is presented and experimentally demonstrated. Results show that 1.0-nm GeO2 is achieved after 120-s N20 plasma oxidation at 300 ℃. The GeO2/Ge interface is atomically smooth. The interface state density of Ge surface after N20 plasma passivation is about - 3 × 1011 cm-2.eV-1. With GeO2 passivation, the hysteresis of metal-oxide-semiconductor （MOS） capacitor with A1203 serving as gate dielectric is reduced to - 50 mV, compared with - 130 mV of the untreated one. The Fermi-level at GeO2/Ge interface is unpinned, and the surface potential is effectively modulated by the gate voltage.展开更多
The influence of an N2O plasma pre-treatment technique on characteristics of AlGaN/GaN high electron mobility transistor（HEMT） prepared by using a plasma-enhanced chemical vapor deposition（PECVD） system is present...The influence of an N2O plasma pre-treatment technique on characteristics of AlGaN/GaN high electron mobility transistor（HEMT） prepared by using a plasma-enhanced chemical vapor deposition（PECVD） system is presented.After the plasma treatment,the peak transconductance（gm） increases from 209 mS/mm to 293 mS/mm.Moreover,it is observed that the reverse gate leakage current is lowered by one order of magnitude and the drain current dispersion is improved in the plasma-treated device.From the analysis of frequency-dependent conductance,it can be seen that the trap state density（DT） and time constant（τT） of the N20-treated device are smaller than those of a non-treated device.The results indicate that the N2O plasma pre-pretreatment before the gate metal deposition could be a promising approach to enhancing the performance of the device.展开更多
It is known that gas flow rate is a key factor in controlling industrial plasma processing. In this paper, a 2D PIC/MCC model is developed for an rf hollow cathode discharge with an axial nitrogen gas flow. The effect...It is known that gas flow rate is a key factor in controlling industrial plasma processing. In this paper, a 2D PIC/MCC model is developed for an rf hollow cathode discharge with an axial nitrogen gas flow. The effects of the gas flow rate on the plasma parameters are calculated and the results show that： with an increasing flow rate, the total ion（N＋2, N＋） density decreases, the mean sheath thickness becomes wider, the radial electric field in the sheath and the axial electric field show an increase, and the energies of both kinds of nitrogen ions increase;and, as the axial ion current density that is moving toward the ground electrode increases, the ion current density near the ground electrode increases. The simulation results will provide a useful reference for plasma jet technology involving rf hollow cathode discharges in N2.展开更多
This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with A...This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.展开更多
The impact of nitridation and sulfur passivation for Ino.s3Gao.47As surfaces on the A1/A1203/InGaAs MOS capacitors properties was investigated by comparing the characteristics of frequency dispersion and hysteresis, c...The impact of nitridation and sulfur passivation for Ino.s3Gao.47As surfaces on the A1/A1203/InGaAs MOS capacitors properties was investigated by comparing the characteristics of frequency dispersion and hysteresis, calculating the Dit and ANbt values, and analyzing the interface traps and the leakage current. The results showed that both of the methods could form a passivation-layer on the InGaAs surface. The samples treated by N2 plasma could obtain good interface properties with the smallest frequency dispersion in the accumulation region, and the best hysteresis characteristics and good I-V properties were presented. Also the samples with （NH4）ESx treatment showed the smallest frequency dispersion near the flat-band region and a minimum Dit value of 2.6 x10^11 cm-2 eV-1.展开更多
A two-dimensional PIC/MCC model is developed to simulate the nitrogen radio frequency hollow cathode discharge（rf-HCD）.It is found that both the sheath oscillation heating and the secondary electron heating together...A two-dimensional PIC/MCC model is developed to simulate the nitrogen radio frequency hollow cathode discharge（rf-HCD）.It is found that both the sheath oscillation heating and the secondary electron heating together play a role to maintain the rf-HCD under the simulated conditions.The mean energy of ions（N＋_2,N＋）in the negative glow region is greater than the thermal kinetic energy of the molecular gas（N2）,which is an important characteristic of rf-HCD.During the negative portion of the hollow electrode voltage cycle,electrons mainly follow pendulum movement and produce a large number of ionization collisions in the plasma region.During the positive voltage of the rf cycle,the axial electric field becomes stronger and its direction is pointing to the anode（substrate）,therefore the ions move toward the anode（substrate）via the axial electric field acceleration.Compared with dc-HCD,rf-HCD is more suitable for serving as a plasma jet nozzle at low pressure.展开更多
The effect of N_(2)-plasma-treated SiO_(2) interfacial layer on the interfacial and electrical characteristics of HfO_(2)/SiO_(2)/p-Si stacks grown by atomic layer deposition(ALD) was investigated.The microstructure a...The effect of N_(2)-plasma-treated SiO_(2) interfacial layer on the interfacial and electrical characteristics of HfO_(2)/SiO_(2)/p-Si stacks grown by atomic layer deposition(ALD) was investigated.The microstructure and interfacial chemical bonding configuration of the HfO_(2)/SiO_(2)/Si stacks were also examined by high-resolution transmission electron microscopy(HRTEM) and X-ray photoelectron spectroscopy(XPS).Compared with the samples without N2-plasma treatment,it is found that the samples with N2-plasma treatment have less oxygen vacancy density for SiO_(2) interfacial layer and better HfO_(2)/SiO_(2) interface.In agreement with XPS analyses,electrical measurements of the samples with N2-plasma treatment show better interfacial quality,including lower interface-state density(Dit,9.3 × 1011 cm^(-2)·eV^(-1) near midgap) and lower oxidecharge density(Q_(ox),2.5 × 1012 cm^(-2)),than those of the samples without N_(2)-plasma treatment.Additionally,the samples with N_(2)-plasma treatment have better electrical performances,including higher saturation capacitance density(1.49 μF·cm^(-2)) and lower leakage current density(3.2 × 10^(-6) A·cm^(-2) at V_(g)=V_(fb)-1 V).Furthermore,constant voltage stress was applied on the gate electrode to investigate the reliability of these samples.It shows that the samples with N_(2)-plasma treatment have better electrical stability than the samples without N_(2)-plasma treatment.展开更多
基金supported by the High Level Talent Project of Xiamen University of Technology,China(Grant Nos.YKJ16012R and YKJ16016R)the National Natural Science Foundation of China(Grant No.51702271)
文摘The N2-plasma treatment on a HfO2 blocking layer of Au nanocrystal nonvolatile memory without any post annealing is investigated. The electrical characteristics of the MOS capacitor with structure of Al–Ta N/HfO2/Si O2/p-Si are also characterized. After N2-plasma treatment, the nitrogen atoms are incorporated into HfO2 film and may passivate the oxygen vacancy states. The surface roughness of HfO2 film can also be reduced. Those improvements of HfO2 film lead to a smaller hysteresis and lower leakage current density of the MOS capacitor. The N2-plasma is introduced into Au nanocrystal（NC） nonvolatile memory to treat the HfO2 blocking layer. For the N2-plasma treated device, it shows a better retention characteristic and is twice as large in the memory window than that for the no N2-plasma treated device. It can be concluded that the N2-plasma treatment method can be applied to future nonvolatile memory applications.
基金supported by the National Basic Research Program of China(Grant No.2011CBA00601)the National Natural Science Foundation of China(Grant Nos.60625403,60806033,and 60925015)
文摘In this paper, oxidation of Ge surface by N2O plasma is presented and experimentally demonstrated. Results show that 1.0-nm GeO2 is achieved after 120-s N20 plasma oxidation at 300 ℃. The GeO2/Ge interface is atomically smooth. The interface state density of Ge surface after N20 plasma passivation is about - 3 × 1011 cm-2.eV-1. With GeO2 passivation, the hysteresis of metal-oxide-semiconductor （MOS） capacitor with A1203 serving as gate dielectric is reduced to - 50 mV, compared with - 130 mV of the untreated one. The Fermi-level at GeO2/Ge interface is unpinned, and the surface potential is effectively modulated by the gate voltage.
基金supported by the National Natural Science Foundation of China(Grant No.61334002)the Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory,China(Grant No.ZHD201206)
文摘The influence of an N2O plasma pre-treatment technique on characteristics of AlGaN/GaN high electron mobility transistor（HEMT） prepared by using a plasma-enhanced chemical vapor deposition（PECVD） system is presented.After the plasma treatment,the peak transconductance（gm） increases from 209 mS/mm to 293 mS/mm.Moreover,it is observed that the reverse gate leakage current is lowered by one order of magnitude and the drain current dispersion is improved in the plasma-treated device.From the analysis of frequency-dependent conductance,it can be seen that the trap state density（DT） and time constant（τT） of the N20-treated device are smaller than those of a non-treated device.The results indicate that the N2O plasma pre-pretreatment before the gate metal deposition could be a promising approach to enhancing the performance of the device.
基金supported by the Natural Science Foundation of Hebei Province,China(No.A2012205072)
文摘It is known that gas flow rate is a key factor in controlling industrial plasma processing. In this paper, a 2D PIC/MCC model is developed for an rf hollow cathode discharge with an axial nitrogen gas flow. The effects of the gas flow rate on the plasma parameters are calculated and the results show that： with an increasing flow rate, the total ion（N＋2, N＋） density decreases, the mean sheath thickness becomes wider, the radial electric field in the sheath and the axial electric field show an increase, and the energies of both kinds of nitrogen ions increase;and, as the axial ion current density that is moving toward the ground electrode increases, the ion current density near the ground electrode increases. The simulation results will provide a useful reference for plasma jet technology involving rf hollow cathode discharges in N2.
基金Project supported by National Advanced Research Program (Grant No 51308030102)Xi’an Applied Materials Innovation Fund (Grant No XA-AM-200616)National Natural Science Foundation of China (Grant Nos 60506020 and 60676048)
文摘This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.
基金supported by the National Natural Science Foundation of China(Nos.61274077,61474031,61464003)the Guangxi Natural Science Foundation(Nos.2013GXNSFGA019003,2013GXNSFAA019335)+2 种基金the Project(No.9140C140101140C14069)the Innovation Project of GUET Graduate Education(No.YJCXS201529)the National Science&Technology Major Project of China(No.2011ZX02708-003)
文摘The impact of nitridation and sulfur passivation for Ino.s3Gao.47As surfaces on the A1/A1203/InGaAs MOS capacitors properties was investigated by comparing the characteristics of frequency dispersion and hysteresis, calculating the Dit and ANbt values, and analyzing the interface traps and the leakage current. The results showed that both of the methods could form a passivation-layer on the InGaAs surface. The samples treated by N2 plasma could obtain good interface properties with the smallest frequency dispersion in the accumulation region, and the best hysteresis characteristics and good I-V properties were presented. Also the samples with （NH4）ESx treatment showed the smallest frequency dispersion near the flat-band region and a minimum Dit value of 2.6 x10^11 cm-2 eV-1.
基金supported by Natural Science Foundation of Hebei Province,China(No.A2012205072)
文摘A two-dimensional PIC/MCC model is developed to simulate the nitrogen radio frequency hollow cathode discharge（rf-HCD）.It is found that both the sheath oscillation heating and the secondary electron heating together play a role to maintain the rf-HCD under the simulated conditions.The mean energy of ions（N＋_2,N＋）in the negative glow region is greater than the thermal kinetic energy of the molecular gas（N2）,which is an important characteristic of rf-HCD.During the negative portion of the hollow electrode voltage cycle,electrons mainly follow pendulum movement and produce a large number of ionization collisions in the plasma region.During the positive voltage of the rf cycle,the axial electric field becomes stronger and its direction is pointing to the anode（substrate）,therefore the ions move toward the anode（substrate）via the axial electric field acceleration.Compared with dc-HCD,rf-HCD is more suitable for serving as a plasma jet nozzle at low pressure.
基金financially supported by the National Science and Technology Major Project of China (No. 2013ZX02303-001-002)。
文摘The effect of N_(2)-plasma-treated SiO_(2) interfacial layer on the interfacial and electrical characteristics of HfO_(2)/SiO_(2)/p-Si stacks grown by atomic layer deposition(ALD) was investigated.The microstructure and interfacial chemical bonding configuration of the HfO_(2)/SiO_(2)/Si stacks were also examined by high-resolution transmission electron microscopy(HRTEM) and X-ray photoelectron spectroscopy(XPS).Compared with the samples without N2-plasma treatment,it is found that the samples with N2-plasma treatment have less oxygen vacancy density for SiO_(2) interfacial layer and better HfO_(2)/SiO_(2) interface.In agreement with XPS analyses,electrical measurements of the samples with N2-plasma treatment show better interfacial quality,including lower interface-state density(Dit,9.3 × 1011 cm^(-2)·eV^(-1) near midgap) and lower oxidecharge density(Q_(ox),2.5 × 1012 cm^(-2)),than those of the samples without N_(2)-plasma treatment.Additionally,the samples with N_(2)-plasma treatment have better electrical performances,including higher saturation capacitance density(1.49 μF·cm^(-2)) and lower leakage current density(3.2 × 10^(-6) A·cm^(-2) at V_(g)=V_(fb)-1 V).Furthermore,constant voltage stress was applied on the gate electrode to investigate the reliability of these samples.It shows that the samples with N_(2)-plasma treatment have better electrical stability than the samples without N_(2)-plasma treatment.
