Mo is difficult to sinter densely at a relatively low temperature due to its high melting point. In the present paper,by adding different weight contents of Ni and Cu additives, Mo alloys have been densified at 1473 K...Mo is difficult to sinter densely at a relatively low temperature due to its high melting point. In the present paper,by adding different weight contents of Ni and Cu additives, Mo alloys have been densified at 1473 K for an hour byhot-pressing method, and the optimum contents of Cu and Ni additives have been acquired: when the contents of Niand Cu are 3 and 2 wt pct respectively, the relative density of the sample reaches the maximum value. It was foundthat when the Ni-Cu solid solution was added into Mo alloys. the achieved density is higher than the case of Ni andCu additives. The experimental results indicate that, Ni and Cu play different roles in the process of sintering, theNi-Cu solid solution has the same function as Ni and Cu additives in the course of sintering Mo alloys, It shows moreactivating sintering feature for Mo than the Ni and Cu additives.展开更多
基金This research is sponsored by the National Natural Science Foundation of China under grant No.50171049.
文摘Mo is difficult to sinter densely at a relatively low temperature due to its high melting point. In the present paper,by adding different weight contents of Ni and Cu additives, Mo alloys have been densified at 1473 K for an hour byhot-pressing method, and the optimum contents of Cu and Ni additives have been acquired: when the contents of Niand Cu are 3 and 2 wt pct respectively, the relative density of the sample reaches the maximum value. It was foundthat when the Ni-Cu solid solution was added into Mo alloys. the achieved density is higher than the case of Ni andCu additives. The experimental results indicate that, Ni and Cu play different roles in the process of sintering, theNi-Cu solid solution has the same function as Ni and Cu additives in the course of sintering Mo alloys, It shows moreactivating sintering feature for Mo than the Ni and Cu additives.
