本文简述了自动测试设备(ATE)测试平台高压板卡的基本功能,包括位置结构、板卡参数指标等,对该板卡的工程应用实践进行了初步探讨。针对较高的时间参数测试精度要求,通过对高压板卡的感应端(Sense)和施加端(Force)进行分析,提出了一种...本文简述了自动测试设备(ATE)测试平台高压板卡的基本功能,包括位置结构、板卡参数指标等,对该板卡的工程应用实践进行了初步探讨。针对较高的时间参数测试精度要求,通过对高压板卡的感应端(Sense)和施加端(Force)进行分析,提出了一种满足时间参数测试精度需求的方法。文中以系统级封装芯片(System in Package,SIP)中的控制单元区域网络(CAN)总线模块为例,以实装测试为参考,将本文设计的方法与开尔文(Kelvin)测试方法进行比较,结果表明,本文设计的方法测试结果更加接近或达到实装测试结果,优化措施成效显著。展开更多
This paper develops a novel distributed temperature measurement system based on DSP and DS18B20 digital thermometer. The real-time temperature of each node in the switchgear is obtained by several DS18B20s which are c...This paper develops a novel distributed temperature measurement system based on DSP and DS18B20 digital thermometer. The real-time temperature of each node in the switchgear is obtained by several DS18B20s which are connected on the 1-wire bus together. RS-485 master-slave communication protocol is used to centralize monitoring temperatures of several switchgear cabinets. The system also has the function of temperature alarm. The operation of simulation experiment has showed that the system is able to complete monitoring real-time temperatures in high voltage switchgear.展开更多
文摘本文简述了自动测试设备(ATE)测试平台高压板卡的基本功能,包括位置结构、板卡参数指标等,对该板卡的工程应用实践进行了初步探讨。针对较高的时间参数测试精度要求,通过对高压板卡的感应端(Sense)和施加端(Force)进行分析,提出了一种满足时间参数测试精度需求的方法。文中以系统级封装芯片(System in Package,SIP)中的控制单元区域网络(CAN)总线模块为例,以实装测试为参考,将本文设计的方法与开尔文(Kelvin)测试方法进行比较,结果表明,本文设计的方法测试结果更加接近或达到实装测试结果,优化措施成效显著。
文摘This paper develops a novel distributed temperature measurement system based on DSP and DS18B20 digital thermometer. The real-time temperature of each node in the switchgear is obtained by several DS18B20s which are connected on the 1-wire bus together. RS-485 master-slave communication protocol is used to centralize monitoring temperatures of several switchgear cabinets. The system also has the function of temperature alarm. The operation of simulation experiment has showed that the system is able to complete monitoring real-time temperatures in high voltage switchgear.
