A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynami...A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing （EDW） is utilized to print the conductor-insulator--conductor multi-layer ~nterconne^ction structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone （PVP） solution is util^zed to f^bricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained ~es^l~s show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10-7 Ω.m and 1.39×10-7 Ω.m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.展开更多
Electrohydrodynamicjet （E-Jet） is an approach to the fabrication of micro/nano-structures by the use of electrical forces. In this process, the liquid is subjected to electrical and mechanical forces to form a liqui...Electrohydrodynamicjet （E-Jet） is an approach to the fabrication of micro/nano-structures by the use of electrical forces. In this process, the liquid is subjected to electrical and mechanical forces to form a liquid jet, which is further disintegrated into droplets. The major advantage of the E-Jet technique is that the sizes of the jet formed can be at the nanoscale far smaller than the nozzle size, which can realize high printing resolution with less risk of nozzle blockage. The E-Jet technique, which mainly includes E-Jet deposition and E-Jet printing, has a wide range of applications in the fabrication ofmicro/nano-structures for micro/nano-electromechanical system devices. This tech- nique is also considered a micro/nano-fabrication method with a great potential for commercial use. This study mainly reviews the E-Jet deposition/printing fundamentals, fabrication process, and applications.展开更多
基金supported by the Key Program of the National Natural Science Foundation of China(Grant No.51035002)the National Natural Science Foundation of China(Grant No.51305373)the Specialized Research Fund for the Doctoral Program of Higher Education of China(Grant No.20120121120035)
文摘A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing （EDW） is utilized to print the conductor-insulator--conductor multi-layer ~nterconne^ction structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone （PVP） solution is util^zed to f^bricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained ~es^l~s show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10-7 Ω.m and 1.39×10-7 Ω.m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.
文摘Electrohydrodynamicjet （E-Jet） is an approach to the fabrication of micro/nano-structures by the use of electrical forces. In this process, the liquid is subjected to electrical and mechanical forces to form a liquid jet, which is further disintegrated into droplets. The major advantage of the E-Jet technique is that the sizes of the jet formed can be at the nanoscale far smaller than the nozzle size, which can realize high printing resolution with less risk of nozzle blockage. The E-Jet technique, which mainly includes E-Jet deposition and E-Jet printing, has a wide range of applications in the fabrication ofmicro/nano-structures for micro/nano-electromechanical system devices. This tech- nique is also considered a micro/nano-fabrication method with a great potential for commercial use. This study mainly reviews the E-Jet deposition/printing fundamentals, fabrication process, and applications.
