We have been developing debris-free laser plasma sources for EUV lithography since 1996. Two types of debris-free sources, such as cryogenic target and gas-puff target laser plasma sources, were designed and built up ...We have been developing debris-free laser plasma sources for EUV lithography since 1996. Two types of debris-free sources, such as cryogenic target and gas-puff target laser plasma sources, were designed and built up in CIOMP. EUV radiation spectra of the sources with a variety of targets have been obtained by different ways.展开更多
A grazing incidence flat-field spectrograph using a concave grating was constructed to measure extreme ultraviolet （EUV） emission from a CO 2 laser-produced tin plasma throughout the wavelength region of 5 nm to 20 ...A grazing incidence flat-field spectrograph using a concave grating was constructed to measure extreme ultraviolet （EUV） emission from a CO 2 laser-produced tin plasma throughout the wavelength region of 5 nm to 20 nm for lithography. Spectral efficiency of the EUV emission around 13.5 nm from plate, cavity, and thin foil tin targets was studied. By translating the focusing lens along the laser axis, the dependence of EUV spectra on the amount of defocus was investigated. The results showed that the spectral efficiency was higher for the cavity target in comparison to the plate or foil target, while it decreased with an increase in the defocus distance. The source＇s spectra and the EUV emission intensity normalized to the incident pulse energy at 45 from the target normal were characterized for the in-band （2% of bandwidth） region as a function of laser energy spanning from 46 mJ to 600 mJ for the pure tin plate target. The energy normalized EUV emission was found to increase with the increasing incident pulse energy. It reached the optimum value for the laser energy of around 343 mJ, after which it dropped rapidly.展开更多
According to the SIA roadmap, by the year of 2006, minimum feature size of 70 nm on wafer is required. Research in U.S., Japan and Europe is aimed at developing and demonstrating an EUVL tool for critical feature size...According to the SIA roadmap, by the year of 2006, minimum feature size of 70 nm on wafer is required. Research in U.S., Japan and Europe is aimed at developing and demonstrating an EUVL tool for critical feature size of 70 nm and below. In Japan, Himeji institute of technology (HIT) has developed an EUVL laboratory tool , which has a practical exposure field of 30mm×28mm. The alignment and assembly of three aspherical mirror optics were completed. A final wave front error of less than 3 nm was achieved. Using this system, exposure experiments are performed using synchrotron facility of New Subaru. Up to now, 56nm patterns have been replicated in the exposure field of 10mm×1mm. And using scanning stages, 100 nm L&S patterns have been replicated in the field of 10mm×5 mm.展开更多
As they are first optimized for their ion losses,ECRISs are always under a fundamental compromise: having high losses and strong confinement at the same time.To help ECR ion source developers in the design or improvem...As they are first optimized for their ion losses,ECRISs are always under a fundamental compromise: having high losses and strong confinement at the same time.To help ECR ion source developers in the design or improvement of existing machines,general comments are presented in a review article being soon published. In this 160 pages contribution,fundamental aspects of ECRISs are presented,with a discussion of electron temperature and confinement and ion confinement.Then,as microwaves play a key role in these machines, a chapter presents major guidelines for microwave launching and coupling to ECR plasma.Moreover,once ECR plasma is created,understanding this plasma is important in ion sourcery;and a section is dedicated to plasma diagnostics with an emphasis on the determination of electron and ion density and temperature by vacuum ultraviolet(VUV)spectroscopy.Another chapter deals with the role of magnetic confinement and presents updated scaling laws.Next chapter presents different types of ECRISs designed according to the main parameters previously described.Finally,some industrial applications of ECRISs and ECR plasmas in general are presented like ion implantation and photon lithography.Some hints taken from this review article are presented in the following article.展开更多
文摘We have been developing debris-free laser plasma sources for EUV lithography since 1996. Two types of debris-free sources, such as cryogenic target and gas-puff target laser plasma sources, were designed and built up in CIOMP. EUV radiation spectra of the sources with a variety of targets have been obtained by different ways.
基金supported by the Scientific Research Foundation of the Education Department of Hubei Province (No.Q20131512)National Natural Science Foundation of China (No.61078024)
文摘A grazing incidence flat-field spectrograph using a concave grating was constructed to measure extreme ultraviolet （EUV） emission from a CO 2 laser-produced tin plasma throughout the wavelength region of 5 nm to 20 nm for lithography. Spectral efficiency of the EUV emission around 13.5 nm from plate, cavity, and thin foil tin targets was studied. By translating the focusing lens along the laser axis, the dependence of EUV spectra on the amount of defocus was investigated. The results showed that the spectral efficiency was higher for the cavity target in comparison to the plate or foil target, while it decreased with an increase in the defocus distance. The source＇s spectra and the EUV emission intensity normalized to the incident pulse energy at 45 from the target normal were characterized for the in-band （2% of bandwidth） region as a function of laser energy spanning from 46 mJ to 600 mJ for the pure tin plate target. The energy normalized EUV emission was found to increase with the increasing incident pulse energy. It reached the optimum value for the laser energy of around 343 mJ, after which it dropped rapidly.
文摘According to the SIA roadmap, by the year of 2006, minimum feature size of 70 nm on wafer is required. Research in U.S., Japan and Europe is aimed at developing and demonstrating an EUVL tool for critical feature size of 70 nm and below. In Japan, Himeji institute of technology (HIT) has developed an EUVL laboratory tool , which has a practical exposure field of 30mm×28mm. The alignment and assembly of three aspherical mirror optics were completed. A final wave front error of less than 3 nm was achieved. Using this system, exposure experiments are performed using synchrotron facility of New Subaru. Up to now, 56nm patterns have been replicated in the exposure field of 10mm×1mm. And using scanning stages, 100 nm L&S patterns have been replicated in the field of 10mm×5 mm.
文摘As they are first optimized for their ion losses,ECRISs are always under a fundamental compromise: having high losses and strong confinement at the same time.To help ECR ion source developers in the design or improvement of existing machines,general comments are presented in a review article being soon published. In this 160 pages contribution,fundamental aspects of ECRISs are presented,with a discussion of electron temperature and confinement and ion confinement.Then,as microwaves play a key role in these machines, a chapter presents major guidelines for microwave launching and coupling to ECR plasma.Moreover,once ECR plasma is created,understanding this plasma is important in ion sourcery;and a section is dedicated to plasma diagnostics with an emphasis on the determination of electron and ion density and temperature by vacuum ultraviolet(VUV)spectroscopy.Another chapter deals with the role of magnetic confinement and presents updated scaling laws.Next chapter presents different types of ECRISs designed according to the main parameters previously described.Finally,some industrial applications of ECRISs and ECR plasmas in general are presented like ion implantation and photon lithography.Some hints taken from this review article are presented in the following article.
