With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not o...With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.展开更多
Cadmium Cobalt Sulphide (CdxCo1-xS) thin film was deposited on microscopic glass substrate using chemical bath deposition technique at room temperature from aqueous solutions of Cadmium Chloride, Cobalt Chloride and T...Cadmium Cobalt Sulphide (CdxCo1-xS) thin film was deposited on microscopic glass substrate using chemical bath deposition technique at room temperature from aqueous solutions of Cadmium Chloride, Cobalt Chloride and Thiourea in which ammonium solution was used as complexing agents. The optical properties were characterized using the absorbance and transmission measurement from Unico UV-2102 PC spectrophotometer, at normal incidence of light in the wavelength range of 200 - 1000 nm. We report the deposition and optimization of the growth parameter with respect to time which showed that the band gap energy and the composition verified from the extended Vegard’s law are highly dependent on deposition time. The average transmittance of the film in VIS-NIR region ranges between 30% and 78% with absorbance range of 0.15 - 0.47 within the same wavelength range. The film was also observed to exhibit poor reflectance (11 x = 0.75;0.83 and 0.94), respectively. Other optical and dielectric properties of the films were also characterized. Based on the exhibited properties of the film, it can be concluded that it is a promising material for selective coatings for solar cells;effective coatings for poultry houses;use as antireflective coating materials, and for fabrication of optoelectronic devices.展开更多
文摘With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.
文摘Cadmium Cobalt Sulphide (CdxCo1-xS) thin film was deposited on microscopic glass substrate using chemical bath deposition technique at room temperature from aqueous solutions of Cadmium Chloride, Cobalt Chloride and Thiourea in which ammonium solution was used as complexing agents. The optical properties were characterized using the absorbance and transmission measurement from Unico UV-2102 PC spectrophotometer, at normal incidence of light in the wavelength range of 200 - 1000 nm. We report the deposition and optimization of the growth parameter with respect to time which showed that the band gap energy and the composition verified from the extended Vegard’s law are highly dependent on deposition time. The average transmittance of the film in VIS-NIR region ranges between 30% and 78% with absorbance range of 0.15 - 0.47 within the same wavelength range. The film was also observed to exhibit poor reflectance (11 x = 0.75;0.83 and 0.94), respectively. Other optical and dielectric properties of the films were also characterized. Based on the exhibited properties of the film, it can be concluded that it is a promising material for selective coatings for solar cells;effective coatings for poultry houses;use as antireflective coating materials, and for fabrication of optoelectronic devices.
