This paper presents a novel approach to design robust Source Coupled Logic (SCL) for implementing ultra low power circuits. In this paper, we propose two different source coupled logic structures and analyze the perfo...This paper presents a novel approach to design robust Source Coupled Logic (SCL) for implementing ultra low power circuits. In this paper, we propose two different source coupled logic structures and analyze the performance of these structures with STSCL (Sub-threshold SCL). The first design under consideration is DTPMOS as load device which analyses the performance of Dynamic Threshold SCL (DTSCL) Logic with previous source coupled logic for ultra low power operation. DTSCL circuits exhibit a better power-delay Performance compared with the STSCL Logic. It can be seen that the proposed circuit provides 56% reduction in power delay product. The second design under consideration uses basic current mirror active load device to provide required voltage swing. Current mirror source coupled logic (CMSCL) can be used for high speed operation. The advantage of this design is that it provides 54% reduction in power delay product over conventional STSCL. The main drawback of this design is that it provides a higher power dissipation compared to other source coupled logic structures. The proposed circuit provides lower sensitivity to temperature and power supply variation, with a superior control over power dissipation. Measurements of test structures simulated in 0.18 μm CMOS technology shows that the proposed DTSCL logic concept can be utilized successfully for bias currents as low as 1 pA. Measurements show that existing standard cell libraries offer a good solution for ultra low power SCL circuits. Cadence Virtuoso schematic editor and Spectre Simulation tools have been used.展开更多
随着晶体管尺寸按比例缩小,越来越薄的氧化层厚度导致栅上的隧穿电流显著地增大,严重地影响器件和电路的静态特性,为此,基于可靠性理论和仿真,对小尺寸MOSFET(metal-oxide-semiconductor field effect transistor)的直接隧穿栅电流进行...随着晶体管尺寸按比例缩小,越来越薄的氧化层厚度导致栅上的隧穿电流显著地增大,严重地影响器件和电路的静态特性,为此,基于可靠性理论和仿真,对小尺寸MOSFET(metal-oxide-semiconductor field effect transistor)的直接隧穿栅电流进行研究,并通过对二输入或非门静态栅泄漏电流的研究,揭示直接隧穿栅电流对CMOS(complementary metal oxide semiconductor)逻辑电路的影响。仿真工具为HSPICE软件,MOS器件模型参数采用的是BSIM4和LEVEL 54,栅氧化层厚度为1.4 nm。研究结果表明:边缘直接隧穿电流是小尺寸MOS器件栅直接隧穿电流的重要组成成分;漏端偏置和衬底偏置通过改变表面势影响栅电流密度;CMOS逻辑电路中MOS器件有4种工作状态,即线性区、饱和区、亚阈区和截止区;CMOS逻辑电路中MOS器件的栅泄漏电流与其工作状态有关。仿真结果与理论分析结果较符合,这些理论和仿真结果有助于以后的集成电路设计。展开更多
文摘This paper presents a novel approach to design robust Source Coupled Logic (SCL) for implementing ultra low power circuits. In this paper, we propose two different source coupled logic structures and analyze the performance of these structures with STSCL (Sub-threshold SCL). The first design under consideration is DTPMOS as load device which analyses the performance of Dynamic Threshold SCL (DTSCL) Logic with previous source coupled logic for ultra low power operation. DTSCL circuits exhibit a better power-delay Performance compared with the STSCL Logic. It can be seen that the proposed circuit provides 56% reduction in power delay product. The second design under consideration uses basic current mirror active load device to provide required voltage swing. Current mirror source coupled logic (CMSCL) can be used for high speed operation. The advantage of this design is that it provides 54% reduction in power delay product over conventional STSCL. The main drawback of this design is that it provides a higher power dissipation compared to other source coupled logic structures. The proposed circuit provides lower sensitivity to temperature and power supply variation, with a superior control over power dissipation. Measurements of test structures simulated in 0.18 μm CMOS technology shows that the proposed DTSCL logic concept can be utilized successfully for bias currents as low as 1 pA. Measurements show that existing standard cell libraries offer a good solution for ultra low power SCL circuits. Cadence Virtuoso schematic editor and Spectre Simulation tools have been used.
文摘随着晶体管尺寸按比例缩小,越来越薄的氧化层厚度导致栅上的隧穿电流显著地增大,严重地影响器件和电路的静态特性,为此,基于可靠性理论和仿真,对小尺寸MOSFET(metal-oxide-semiconductor field effect transistor)的直接隧穿栅电流进行研究,并通过对二输入或非门静态栅泄漏电流的研究,揭示直接隧穿栅电流对CMOS(complementary metal oxide semiconductor)逻辑电路的影响。仿真工具为HSPICE软件,MOS器件模型参数采用的是BSIM4和LEVEL 54,栅氧化层厚度为1.4 nm。研究结果表明:边缘直接隧穿电流是小尺寸MOS器件栅直接隧穿电流的重要组成成分;漏端偏置和衬底偏置通过改变表面势影响栅电流密度;CMOS逻辑电路中MOS器件有4种工作状态,即线性区、饱和区、亚阈区和截止区;CMOS逻辑电路中MOS器件的栅泄漏电流与其工作状态有关。仿真结果与理论分析结果较符合,这些理论和仿真结果有助于以后的集成电路设计。
