Using the nano-moiré method, we measure the near tip nanoscopic deformation on the [111] plane of single crystal silicon with a loaded quasi-cleavage crack running in the [110] direction. The measured strain dist...Using the nano-moiré method, we measure the near tip nanoscopic deformation on the [111] plane of single crystal silicon with a loaded quasi-cleavage crack running in the [110] direction. The measured strain distribution ahead of the crack tip agrees with the linear elastic fracture mechanics prediction up to 10 nm from the crack tip. Dislocations of Peierls type are detected and they extend from the crack tip over a length of hundreds of Burgers vectors.展开更多
Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials b...Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteris- tics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.展开更多
文摘Using the nano-moiré method, we measure the near tip nanoscopic deformation on the [111] plane of single crystal silicon with a loaded quasi-cleavage crack running in the [110] direction. The measured strain distribution ahead of the crack tip agrees with the linear elastic fracture mechanics prediction up to 10 nm from the crack tip. Dislocations of Peierls type are detected and they extend from the crack tip over a length of hundreds of Burgers vectors.
文摘Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteris- tics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.
