The main goal of this study is to investigate the microstructure and electrical properties of Al–Zr–La alloys under different hot compression deformation temperatures. In particular, a Gleeble 3500 thermal simulator...The main goal of this study is to investigate the microstructure and electrical properties of Al–Zr–La alloys under different hot compression deformation temperatures. In particular, a Gleeble 3500 thermal simulator was used to carry out multi-pass hot compression tests. For five-pass hot compression deformation, the last-pass deformation temperatures were 240, 260, 300, 340, 380, and 420°C, respectively, where the first-pass deformation temperature was 460°C. The experimental results indicated that increasing the hot compression deformation temperature with each pass resulted in improved electrical conductivity of the alloy. Consequently, the flow stress was reduced after deformation of the samples subjected to the same number of passes. In addition, the dislocation density gradually decreased and the grain size increased after hot compression deformation. Furthermore, the dynamic recrystallization behavior was effectively suppressed during the hot compression process because spherical Al;Zr precipitates pinned the dislocation movement effectively and prevented grain boundary sliding.展开更多
基金Sichuan Provincial Development and Reform Commission for funding this work by Panxi Strategic Resources Innovation Development Fund (2015)the department of Science and Technology of Sichuan Province (2015GZ0052)
文摘The main goal of this study is to investigate the microstructure and electrical properties of Al–Zr–La alloys under different hot compression deformation temperatures. In particular, a Gleeble 3500 thermal simulator was used to carry out multi-pass hot compression tests. For five-pass hot compression deformation, the last-pass deformation temperatures were 240, 260, 300, 340, 380, and 420°C, respectively, where the first-pass deformation temperature was 460°C. The experimental results indicated that increasing the hot compression deformation temperature with each pass resulted in improved electrical conductivity of the alloy. Consequently, the flow stress was reduced after deformation of the samples subjected to the same number of passes. In addition, the dislocation density gradually decreased and the grain size increased after hot compression deformation. Furthermore, the dynamic recrystallization behavior was effectively suppressed during the hot compression process because spherical Al;Zr precipitates pinned the dislocation movement effectively and prevented grain boundary sliding.
