Cu Ag Cr合金是一种高强度高电导新型材料。采用真空熔炼的方法制备了Cu Ag Cr合金,经合适的工艺处理后,在电导率基本上不降低的前提下,能显著提高合金的强度和硬度,抗拉强度达到529MPa,电导率为92.11%(IACS),基本满足对铜合金高强高导...Cu Ag Cr合金是一种高强度高电导新型材料。采用真空熔炼的方法制备了Cu Ag Cr合金,经合适的工艺处理后,在电导率基本上不降低的前提下,能显著提高合金的强度和硬度,抗拉强度达到529MPa,电导率为92.11%(IACS),基本满足对铜合金高强高导的性能要求。在同样条件下,与Cu Ag合金相比,其强度和硬度的提高主要是由共格析出强化造成,由于析出相尺寸较大,以Orowan机制强化,强化效应与采用Orowan强化机制计算的结果非常接近。展开更多
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve...The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.展开更多
研究了4种不同锡含量的Ag-Sn合金在700℃和800℃的氧化行为.结果表明,当锡含量小于4 m ass%时,在表面有银出现,其下形成一层薄的外氧化膜,氧可以扩散到基体内部使基体完全内氧化;当锡含量大于5 m ass%时,在合金的外表面出现少许银,其下...研究了4种不同锡含量的Ag-Sn合金在700℃和800℃的氧化行为.结果表明,当锡含量小于4 m ass%时,在表面有银出现,其下形成一层薄的外氧化膜,氧可以扩散到基体内部使基体完全内氧化;当锡含量大于5 m ass%时,在合金的外表面出现少许银,其下为较厚的连续外氧化膜,内氧化前沿为富集内氧化产物并沿原合金晶界连成的网络.文中对这两种特性的氧化行为进行了具体阐述.展开更多
The thermodynamic data of pure Ag and Y were calculated. The phase constitution, composition of micro-region and microstructures of Ag-Y alloy after internal oxidation were investigated by X-ray diffractometry(XRD), e...The thermodynamic data of pure Ag and Y were calculated. The phase constitution, composition of micro-region and microstructures of Ag-Y alloy after internal oxidation were investigated by X-ray diffractometry(XRD), energy dispersion spectrometry(EDS) and scanning electron microscopy(SEM). The results show that the internal oxidation behavior of Ag-Y alloy is feasible from the view of thermodynamics. The upper limit of oxygen partial pressure of Ag-Y alloy oxidation is a function of temperature. Two phases (Ag and Y2O3) appear in Ag-Y alloy after the internal oxidation. The surface of Ag-Y alloy is convex because of the volume expansion of oxide in the alloy and the composition of the convex part is Ag. In Ag-Y2O3 sintered bulk Y2O3 particles are distributed inhomogeneously and conglomerated seriously, but they are dispersed uniformly in the Ag matrix after severe plastic deformation.展开更多
文摘Cu Ag Cr合金是一种高强度高电导新型材料。采用真空熔炼的方法制备了Cu Ag Cr合金,经合适的工艺处理后,在电导率基本上不降低的前提下,能显著提高合金的强度和硬度,抗拉强度达到529MPa,电导率为92.11%(IACS),基本满足对铜合金高强高导的性能要求。在同样条件下,与Cu Ag合金相比,其强度和硬度的提高主要是由共格析出强化造成,由于析出相尺寸较大,以Orowan机制强化,强化效应与采用Orowan强化机制计算的结果非常接近。
文摘The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.
文摘研究了4种不同锡含量的Ag-Sn合金在700℃和800℃的氧化行为.结果表明,当锡含量小于4 m ass%时,在表面有银出现,其下形成一层薄的外氧化膜,氧可以扩散到基体内部使基体完全内氧化;当锡含量大于5 m ass%时,在合金的外表面出现少许银,其下为较厚的连续外氧化膜,内氧化前沿为富集内氧化产物并沿原合金晶界连成的网络.文中对这两种特性的氧化行为进行了具体阐述.
基金Project(2006BAE03B03) supported by the National Science and Technology Program of China
文摘The thermodynamic data of pure Ag and Y were calculated. The phase constitution, composition of micro-region and microstructures of Ag-Y alloy after internal oxidation were investigated by X-ray diffractometry(XRD), energy dispersion spectrometry(EDS) and scanning electron microscopy(SEM). The results show that the internal oxidation behavior of Ag-Y alloy is feasible from the view of thermodynamics. The upper limit of oxygen partial pressure of Ag-Y alloy oxidation is a function of temperature. Two phases (Ag and Y2O3) appear in Ag-Y alloy after the internal oxidation. The surface of Ag-Y alloy is convex because of the volume expansion of oxide in the alloy and the composition of the convex part is Ag. In Ag-Y2O3 sintered bulk Y2O3 particles are distributed inhomogeneously and conglomerated seriously, but they are dispersed uniformly in the Ag matrix after severe plastic deformation.
