采用水热法制备了不同Ag修饰量的Ag/MoO_2纳米复合材料,并利用浸渍法将其负载在多孔泡沫镍(Nickel foam,NF)上制备成Ag/MoO_2/NF无粘结剂型直接电极。在该电极中Ag/MoO_2纳米颗粒均匀地负载在泡沫镍上形成了三维网络结构,其中MoO_2纳米...采用水热法制备了不同Ag修饰量的Ag/MoO_2纳米复合材料,并利用浸渍法将其负载在多孔泡沫镍(Nickel foam,NF)上制备成Ag/MoO_2/NF无粘结剂型直接电极。在该电极中Ag/MoO_2纳米颗粒均匀地负载在泡沫镍上形成了三维网络结构,其中MoO_2纳米颗粒是由~10 nm的纳米晶组成。当Ag修饰量为5%时,Ag0.05/MoO_2/NF具有最佳的电化学性能:在0.1 C的电流密度下,首次放电比容量高达1180 m Ah/g,100次循环后仍保持805 m Ah/g;且当电流密度由2 C降低至0.1 C时,比容量由468 m Ah/g升高至820 m Ah/g,表现出优异的储锂性能。展开更多
光催化灭活是公认的控制病原微生物最具前景手段之一。本文以尿素和硫代巴比妥酸为起始原料,通过热聚合反应制备S掺杂g-C_(3)N_(4)(SCN),随后采用光还原法将Ag纳米粒负载于SCN表面获得新颖的可见光响应型Ag/SCN抗菌材料。对所制备纳米...光催化灭活是公认的控制病原微生物最具前景手段之一。本文以尿素和硫代巴比妥酸为起始原料,通过热聚合反应制备S掺杂g-C_(3)N_(4)(SCN),随后采用光还原法将Ag纳米粒负载于SCN表面获得新颖的可见光响应型Ag/SCN抗菌材料。对所制备纳米材料进行XRD、SEM、TEM、XPS及UV-Vis DRS表征,并深入探讨其在可见光下灭活大肠杆菌(E.coli)的性能和机制。结果表明,Ag纳米粒均匀且牢固地负载在SCN表面,纳米材料表现出显著增强的可见光响应能力。当负载量为6%时,Ag/SCN-6呈现出最佳的光催化灭菌活性,60 min内能够将6.2 lg CFU·mL^(-1)的E.coli全部灭活。自由基捕获实验结果表明,超氧自由基(·O-2)是灭活过程中最主要活性物种,它协同光生空穴(h+)和羟基自由基(·OH)主导了光催化抗菌的进程。展开更多
To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0...To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0×10^(4) A/cm^(2))for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu(SAC/AgGNSs)solder joints.The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints,providing more Cu6 Sn5 grain nucleation sites,which refined these grains and reduced the thickness difference at the anode and cathode.In addition,the Cu6 Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling.The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes.展开更多
文摘采用水热法制备了不同Ag修饰量的Ag/MoO_2纳米复合材料,并利用浸渍法将其负载在多孔泡沫镍(Nickel foam,NF)上制备成Ag/MoO_2/NF无粘结剂型直接电极。在该电极中Ag/MoO_2纳米颗粒均匀地负载在泡沫镍上形成了三维网络结构,其中MoO_2纳米颗粒是由~10 nm的纳米晶组成。当Ag修饰量为5%时,Ag0.05/MoO_2/NF具有最佳的电化学性能:在0.1 C的电流密度下,首次放电比容量高达1180 m Ah/g,100次循环后仍保持805 m Ah/g;且当电流密度由2 C降低至0.1 C时,比容量由468 m Ah/g升高至820 m Ah/g,表现出优异的储锂性能。
文摘光催化灭活是公认的控制病原微生物最具前景手段之一。本文以尿素和硫代巴比妥酸为起始原料,通过热聚合反应制备S掺杂g-C_(3)N_(4)(SCN),随后采用光还原法将Ag纳米粒负载于SCN表面获得新颖的可见光响应型Ag/SCN抗菌材料。对所制备纳米材料进行XRD、SEM、TEM、XPS及UV-Vis DRS表征,并深入探讨其在可见光下灭活大肠杆菌(E.coli)的性能和机制。结果表明,Ag纳米粒均匀且牢固地负载在SCN表面,纳米材料表现出显著增强的可见光响应能力。当负载量为6%时,Ag/SCN-6呈现出最佳的光催化灭菌活性,60 min内能够将6.2 lg CFU·mL^(-1)的E.coli全部灭活。自由基捕获实验结果表明,超氧自由基(·O-2)是灭活过程中最主要活性物种,它协同光生空穴(h+)和羟基自由基(·OH)主导了光催化抗菌的进程。
基金financial support from the National Natural Science Foundation of China(No.51974198)。
文摘To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0×10^(4) A/cm^(2))for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu(SAC/AgGNSs)solder joints.The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints,providing more Cu6 Sn5 grain nucleation sites,which refined these grains and reduced the thickness difference at the anode and cathode.In addition,the Cu6 Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling.The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes.
