Ni-based alloy was transient liquid phase bonded using a BNi-2 interlayer. The effect of bonding parameters on the microstructures and mechanical properties of the joints was investigated. With the increase of bonding...Ni-based alloy was transient liquid phase bonded using a BNi-2 interlayer. The effect of bonding parameters on the microstructures and mechanical properties of the joints was investigated. With the increase of bonding temperature or time, the number of Ni-rich and Cr-rich borides and the grain size of precipitation zone decrease. Higher bonding temperature or longer bonding time is beneficial to the diffusion of melting point depressant elements （B and Si） from the PZ to the base metal and atomic interdiffusion between the base metal and the joint. The chemical composition and microstructure of the joints bonded at 1170 ℃ for 24 h are comparable to the base metal. The shear test results show that both the room and elevated temperature shear-strengths of the joints increase with increasing bonding time. However, the effect of bonding time on elevated temperature tensile-shear strength is greater than on room temperature tensile-shear strength.展开更多
Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetall...Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.展开更多
基金Projects (50975062, 51105107, 51275135, 51021002) supported by the National Natural Science Foundation of ChinaProject (QC2011C044) supported by the Natural Science Foundation of Heilongjiang Province, China+1 种基金Project (20112302130005) supported by Specialized Research Fund for the Doctoral Program of Higher Education, ChinaProject (20100471027) supported by the Postdoctoral Science Foundation of China
文摘Ni-based alloy was transient liquid phase bonded using a BNi-2 interlayer. The effect of bonding parameters on the microstructures and mechanical properties of the joints was investigated. With the increase of bonding temperature or time, the number of Ni-rich and Cr-rich borides and the grain size of precipitation zone decrease. Higher bonding temperature or longer bonding time is beneficial to the diffusion of melting point depressant elements （B and Si） from the PZ to the base metal and atomic interdiffusion between the base metal and the joint. The chemical composition and microstructure of the joints bonded at 1170 ℃ for 24 h are comparable to the base metal. The shear test results show that both the room and elevated temperature shear-strengths of the joints increase with increasing bonding time. However, the effect of bonding time on elevated temperature tensile-shear strength is greater than on room temperature tensile-shear strength.
基金Project(51375260) supported by the National Natural Science Foundation of China
文摘Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.
