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用于MEMS器件的键合工艺研究进展 被引量:12
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作者 张东梅 叶枝灿 +1 位作者 丁桂甫 汪红 《电子工艺技术》 2005年第6期315-318,共4页
随着MEMS器件的广泛研究和快速进步,非硅基材料被广泛用于MEMS器件中。键合技术成为MEMS器件制作、组装和封装的关键性技术之一,它不仅可以降低工艺的复杂性,而且使许多新技术和新应用在MEMS器件中得以实现。目前主要的键合技术包括直... 随着MEMS器件的广泛研究和快速进步,非硅基材料被广泛用于MEMS器件中。键合技术成为MEMS器件制作、组装和封装的关键性技术之一,它不仅可以降低工艺的复杂性,而且使许多新技术和新应用在MEMS器件中得以实现。目前主要的键合技术包括直接键合、阳极键合、粘结剂键合和共晶键合。 展开更多
关键词 直接 阳极 粘结剂 共晶
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A Novel Capacitive Pressure Sensor 被引量:7
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作者 黄晓东 黄见秋 +1 位作者 秦明 黄庆安 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第3期428-432,共5页
A novel capacitive pressure sensor is presented, whose sensing structure is a solid-state capacitor consisting of three square membranes with Al/SiO2/n-type silicon. It was fabricated using pn junction self-stop etchi... A novel capacitive pressure sensor is presented, whose sensing structure is a solid-state capacitor consisting of three square membranes with Al/SiO2/n-type silicon. It was fabricated using pn junction self-stop etching combined with adhesive bonding,and only three masks were used during the process. Sensors with side lengths of 1000,1200,and 1400μm were fabricated,showing sensitivity of 1.8,2.3, and 3.6fF/hPa over the range of 410~ 1010hPa, respectively. The sensi- tivity of the sensor with a side length of 1500μm is 4. 6fF/hPa,the nonlinearity is 6. 4% ,and the max hysteresis is 3.6%. The results show that permittivity change plays an important part in the capacitance change. 展开更多
关键词 capacitive pressure senor ELECTROSTRICTION pn junction self-stop etching adhesive bonding LINEARITY
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