Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results ...Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.展开更多
High machining precision and machining efficiency can be obtained in grinding WC-Co coating by cup wheel. The conventional model of the grinding force is not suitable for the grinding of the cup wheel due to the diffe...High machining precision and machining efficiency can be obtained in grinding WC-Co coating by cup wheel. The conventional model of the grinding force is not suitable for the grinding of the cup wheel due to the difference in grinding style between the cup wheel and the conventional external wheel. So the grit grinding process of the cup wheel is studied, and a new concept of the effective grinding width of the cup wheel is presented. Then the grinding force in grinding WC-Co coating materials by cup wheel is analyzed and a theoretical formula is deduced. Finally, experimental results of the grinding force verify the correctness and the precision of the theoretical formula.展开更多
The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wh...The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.展开更多
基金Project (50975040) supported by the National Natural Science Foundation of China
文摘Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.
文摘High machining precision and machining efficiency can be obtained in grinding WC-Co coating by cup wheel. The conventional model of the grinding force is not suitable for the grinding of the cup wheel due to the difference in grinding style between the cup wheel and the conventional external wheel. So the grit grinding process of the cup wheel is studied, and a new concept of the effective grinding width of the cup wheel is presented. Then the grinding force in grinding WC-Co coating materials by cup wheel is analyzed and a theoretical formula is deduced. Finally, experimental results of the grinding force verify the correctness and the precision of the theoretical formula.
基金Supported by the Open L ab.Foundation of Educational Ministryof China
文摘The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.
