p-GaN cap layer has been recognized as a commercial technology to manufacture enhanced-mode(E-mode)AlGaN/GaN high electron mobility transistor(HEMT);however,the difficult activation of Mg doping and etching damage of ...p-GaN cap layer has been recognized as a commercial technology to manufacture enhanced-mode(E-mode)AlGaN/GaN high electron mobility transistor(HEMT);however,the difficult activation of Mg doping and etching damage of p-GaN limit the further improvement of device performance.Thus,the more cost-effective cap layer has attracted wide attention in GaN-based HEMT.In this paper,p-type tin monoxide(p-SnO)was firstly investigated as a gate cap to realize E-mode AlGaN/GaN HEMT by both Silvaco simulation and experiment.Simulation results show that by simply adjusting the thickness(50 to 200 nm)or the doping concentration(3×10^(17)to 3×10^(18)cm^(-3))of p-SnO,the threshold voltage(V_(th))of HEMT can be continuously adjusted in the range from zero to 10 V.Simultaneously,the device demonstrated a drain current density above 120 mA mm^(-1),a gate breakdown voltage(V_(BG))of 7.5 V and a device breakdown voltage(V_(B))of 2470 V.What is more,the etching-free AlGaN/GaN HEMT with sputtered p-SnO gate cap were fabricated,and achieved a positive V_(th) of 1 V,V_(BG) of 4.2 V and V_(B) of 420 V,which confirms the application potential of the p-SnO film as a gate cap layer for E-mode GaN-based HEMT.This work is instructive to the design and manufacture of p-oxide gate cap E-mode AlGaN/GaN HEMT with low cost.展开更多
基于解析分析对比了大尺寸与深亚微米尺度下静态随机存取存储器(static random access memory,SRAM)单元单粒子翻转敏感性的表征值及引入累积辐照后的变化趋势.同时借助仿真模拟计算了0.18μm工艺对应的六管SRAM单元在对应不同累积剂量...基于解析分析对比了大尺寸与深亚微米尺度下静态随机存取存储器(static random access memory,SRAM)单元单粒子翻转敏感性的表征值及引入累积辐照后的变化趋势.同时借助仿真模拟计算了0.18μm工艺对应的六管SRAM单元在对应不同累积剂量情况下,离子分别入射不同中心单管时的电学响应变化,计算结果与解析分析所得推论相一致,即只有当累积辐照阶段与单粒子作用阶段存储相反数值时,SRAM单元的单粒子翻转敏感性才会增强.展开更多
基金supported by the National Natural Science Foundation of China(62003151,61925404,62074122,and 61904139)the Key Research and Development Program in Shaanxi Province(2016KTZDGY-03-01)。
文摘p-GaN cap layer has been recognized as a commercial technology to manufacture enhanced-mode(E-mode)AlGaN/GaN high electron mobility transistor(HEMT);however,the difficult activation of Mg doping and etching damage of p-GaN limit the further improvement of device performance.Thus,the more cost-effective cap layer has attracted wide attention in GaN-based HEMT.In this paper,p-type tin monoxide(p-SnO)was firstly investigated as a gate cap to realize E-mode AlGaN/GaN HEMT by both Silvaco simulation and experiment.Simulation results show that by simply adjusting the thickness(50 to 200 nm)or the doping concentration(3×10^(17)to 3×10^(18)cm^(-3))of p-SnO,the threshold voltage(V_(th))of HEMT can be continuously adjusted in the range from zero to 10 V.Simultaneously,the device demonstrated a drain current density above 120 mA mm^(-1),a gate breakdown voltage(V_(BG))of 7.5 V and a device breakdown voltage(V_(B))of 2470 V.What is more,the etching-free AlGaN/GaN HEMT with sputtered p-SnO gate cap were fabricated,and achieved a positive V_(th) of 1 V,V_(BG) of 4.2 V and V_(B) of 420 V,which confirms the application potential of the p-SnO film as a gate cap layer for E-mode GaN-based HEMT.This work is instructive to the design and manufacture of p-oxide gate cap E-mode AlGaN/GaN HEMT with low cost.
文摘基于解析分析对比了大尺寸与深亚微米尺度下静态随机存取存储器(static random access memory,SRAM)单元单粒子翻转敏感性的表征值及引入累积辐照后的变化趋势.同时借助仿真模拟计算了0.18μm工艺对应的六管SRAM单元在对应不同累积剂量情况下,离子分别入射不同中心单管时的电学响应变化,计算结果与解析分析所得推论相一致,即只有当累积辐照阶段与单粒子作用阶段存储相反数值时,SRAM单元的单粒子翻转敏感性才会增强.
