Large-size thin-walled curved surface parts of pure iron are crucial in aerospace,national defense,energy and precision physical experiments.However,the high machining accuracy and surface quality are difficult to ach...Large-size thin-walled curved surface parts of pure iron are crucial in aerospace,national defense,energy and precision physical experiments.However,the high machining accuracy and surface quality are difficult to achieve due to the serious tool wear and deformation when machining the parts with conventional cutting tools.In this paper,an elliptical vibration cutting(EVC)with active cutting edge shift(ACES)based on a long arbor vibration device is proposed for ultraprecision machining the pure iron parts by using diamond tool.Compared with cutting at a fixed cutting edge,the influence of ACES on the EVC was analyzed.Experiments in EVC of pure iron with ACES were conducted.The evolutions of the surface roughness,surface topography,and chip morphology with tool wear in EVC with ACES are revealed.The reasonable parameters of ultraprecision machining the pure iron parts by EVC with ACES were determined.It shows that the ACES has a slight influence on the machined surface roughness and surface topography.The diamond tool life can be significantly prolonged in EVC of pure iron with ACES than that with a fixed cutting edge,so that high profile accuracy and surface quality could be obtained even at higher nominal cutting speed.A typical thin-walled curved surface pure iron part with diameter φ240 mm,height 122 mm,and wall thickness 2 mm was fabricated by the presented method,and its profile error and surface roughness achieved PV 2.2μm and Ra less than 50 nm,respectively.展开更多
The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate p...The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits.The formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.展开更多
基金the financial support from Science Challenge Project(No.TZ2016006-0103-01)National Natural Science Foundation of China(No.51975096 and No.51805498).
文摘Large-size thin-walled curved surface parts of pure iron are crucial in aerospace,national defense,energy and precision physical experiments.However,the high machining accuracy and surface quality are difficult to achieve due to the serious tool wear and deformation when machining the parts with conventional cutting tools.In this paper,an elliptical vibration cutting(EVC)with active cutting edge shift(ACES)based on a long arbor vibration device is proposed for ultraprecision machining the pure iron parts by using diamond tool.Compared with cutting at a fixed cutting edge,the influence of ACES on the EVC was analyzed.Experiments in EVC of pure iron with ACES were conducted.The evolutions of the surface roughness,surface topography,and chip morphology with tool wear in EVC with ACES are revealed.The reasonable parameters of ultraprecision machining the pure iron parts by EVC with ACES were determined.It shows that the ACES has a slight influence on the machined surface roughness and surface topography.The diamond tool life can be significantly prolonged in EVC of pure iron with ACES than that with a fixed cutting edge,so that high profile accuracy and surface quality could be obtained even at higher nominal cutting speed.A typical thin-walled curved surface pure iron part with diameter φ240 mm,height 122 mm,and wall thickness 2 mm was fabricated by the presented method,and its profile error and surface roughness achieved PV 2.2μm and Ra less than 50 nm,respectively.
基金The 2019 Ministry of Education industry-university cooperation collaborative education project“Research on the Construction of Economics and Management Professional Data Analysis Laboratory”(Project number:201902077020)。
文摘The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered.The video camera and the pattern recognition system(PRS)of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits.The formation of the loop wire cycle is ensured by the synchronous movement of the bonding head along the Z axis and the working table along the XY axes based on the servo drive.A feature of the bonder is that it can bond all the wire loops of the electronic device according to the pre-recorded program without needing to align the bonding points.
