Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is import...Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.展开更多
在光学加工领域,采用功率谱密度(power spectral density,PSD)对误差频谱方面信息进行表征,但是功率谱密度是表面误差统计信息,不如峰谷值(peak-valley,PV)和均方根值(root mean square,RMS)直观。为了分析功率谱密度与工艺参数之间的关...在光学加工领域,采用功率谱密度(power spectral density,PSD)对误差频谱方面信息进行表征,但是功率谱密度是表面误差统计信息,不如峰谷值(peak-valley,PV)和均方根值(root mean square,RMS)直观。为了分析功率谱密度与工艺参数之间的关系,该文从PSD定义出发,分析了随机面形轮廓不同参数对光学PSD的影响规律,总结了PSD控制的要点,在平面玻璃上对数控抛光典型路径下加工的PSD曲线进行分析。分析结果表明:PSD与随机轮廓幅值、频率分布有关,相位对它几乎无影响;在RMS接近情况下,PSD线性拟合斜率和RMS Slope随随机轮廓的自相关长度增加而下降;短程加工路径相较于长程有序路径能够有效抑制PSD曲线峰值,使得光学元件符合频谱抑制要求。展开更多
基金Project supported by the National High Technology Research and Development Program of China(No.2008AA042505)the National Science and Technology Key Project Program(No.2009ZX02011)the Natural Science Foundation of Guangdong Province,China (No.U0734008)
文摘Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.
