采用T-F(Tests and finite element analysis)方法,通过小尺寸圆环试样单轴压缩试验,引入单轴本构关系模型进行有限元迭代计算使得模拟计算的试样变形与圆环试样压缩实验结果满足一致性,进而得到材料单轴弹塑性本构关系参数。研究表明,...采用T-F(Tests and finite element analysis)方法,通过小尺寸圆环试样单轴压缩试验,引入单轴本构关系模型进行有限元迭代计算使得模拟计算的试样变形与圆环试样压缩实验结果满足一致性,进而得到材料单轴弹塑性本构关系参数。研究表明,对不同厚度的304不锈钢圆环,应用T-F方法获得的材料本构关系与单轴拉伸试验结果吻合较好。基于小尺寸材料的T-F方法在获取小尺寸构件的力学性能方面有良好的工程应用前景。展开更多
In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to in...In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-SSb solder which has a higher melting point temperature than that of Sn- Ag-Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propa- gation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn-5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.展开更多
文摘采用T-F(Tests and finite element analysis)方法,通过小尺寸圆环试样单轴压缩试验,引入单轴本构关系模型进行有限元迭代计算使得模拟计算的试样变形与圆环试样压缩实验结果满足一致性,进而得到材料单轴弹塑性本构关系参数。研究表明,对不同厚度的304不锈钢圆环,应用T-F方法获得的材料本构关系与单轴拉伸试验结果吻合较好。基于小尺寸材料的T-F方法在获取小尺寸构件的力学性能方面有良好的工程应用前景。
文摘In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-SSb solder which has a higher melting point temperature than that of Sn- Ag-Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propa- gation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn-5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.
