The 28 nm process has a high cost-performance ratio and has gradually become the standard for the field of radiation-hardened devices.However,owing to the minimum physical gate length of only 35 nm,the physical area o...The 28 nm process has a high cost-performance ratio and has gradually become the standard for the field of radiation-hardened devices.However,owing to the minimum physical gate length of only 35 nm,the physical area of a standard 6T SRAM unit is approximately 0.16μm^(2),resulting in a significant enhancement of multi-cell charge-sharing effects.Multiple-cell upsets(MCUs)have become the primary physical mechanism behind single-event upsets(SEUs)in advanced nanometer node devices.The range of ionization track effects increases with higher ion energies,and spacecraft in orbit primarily experience SEUs caused by high-energy ions.However,ground accelerator experiments have mainly obtained low-energy ion irradiation data.Therefore,the impact of ion energy on the SEU cross section,charge collection mechanisms,and MCU patterns and quantities in advanced nanometer devices remains unclear.In this study,based on the experimental platform of the Heavy Ion Research Facility in Lanzhou,low-and high-energy heavy-ion beams were used to study the SEUs of 28 nm SRAM devices.The influence of ion energy on the charge collection processes of small-sensitive-volume devices,MCU patterns,and upset cross sections was obtained,and the applicable range of the inverse cosine law was clarified.The findings of this study are an important guide for the accurate evaluation of SEUs in advanced nanometer devices and for the development of radiation-hardening techniques.展开更多
To predict the soft error rate for applications, it is essential to study the energy dependence of the single-event-upset(SEU) cross-section. In this work, we present a direct measurement of the SEU cross-section with...To predict the soft error rate for applications, it is essential to study the energy dependence of the single-event-upset(SEU) cross-section. In this work, we present a direct measurement of the SEU cross-section with the Back-n white neutron source at the China Spallation Neutron Source. The measured cross section is consistent with the soft error data from the manufacturer and the result suggests that the threshold energy of the SEU is about 0.5 Me V, which confirms the statement in Iwashita’s report that the threshold energy for neutron soft error is much below that of the(n, α) cross-section of silicon.In addition, an index of the effective neutron energy is suggested to characterize the similarity between a spallation neutron beam and the standard atmospheric neutron environment.展开更多
Resistive Random-Access Memory(ReRAM)based Processing-in-Memory(PIM)frameworks are proposed to accelerate the working process of DNN models by eliminating the data movement between the computing and memory units.To fu...Resistive Random-Access Memory(ReRAM)based Processing-in-Memory(PIM)frameworks are proposed to accelerate the working process of DNN models by eliminating the data movement between the computing and memory units.To further mitigate the space and energy consumption,DNN model weight sparsity and weight pattern repetition are exploited to optimize these ReRAM-based accelerators.However,most of these works only focus on one aspect of this software/hardware codesign framework and optimize them individually,which makes the design far from optimal.In this paper,we propose PRAP-PIM,which jointly exploits the weight sparsity and weight pattern repetition by using a weight pattern reusing aware pruning method.By relaxing the weight pattern reusing precondition,we propose a similarity-based weight pattern reusing method that can achieve a higher weight pattern reusing ratio.Experimental results show that PRAP-PIM achieves 1.64×performance improvement and 1.51×energy efficiency improvement in popular deep learning benchmarks,compared with the state-of-the-art ReRAM-based DNN accelerators.展开更多
Sn-doped Ge2Sb2Te5 thin films deposited on Si（100）/SiO2 substrates by rf magnetron sputtering are investigated by a differential scanning calorimeter, x-ray diffraction and sheet resistance measurement. The crystall...Sn-doped Ge2Sb2Te5 thin films deposited on Si（100）/SiO2 substrates by rf magnetron sputtering are investigated by a differential scanning calorimeter, x-ray diffraction and sheet resistance measurement. The crystallization temperatures of the 3.58 at.%, 6.92 at.% and 10.04 at.% Sn-doped Ge2Sb2Te5 thin films have decreases of 5.3, 6.1 and 0.9℃, respectively, which is beneficial to reduce the switching current for the amorphous-to-crystalline phase transition. Due to Sn-doping, the sheet resistance of crystalline Ge2Sb2Te5 thin films increases about 2-10 times, which may be useful to reduce the switching current for the amorphous-to-crystalline phase change. In addition, an obvious decreasing dispersibility for the sheet resistance of Sn-doped Ge2Sb2Te5 thin films in the crystalline state has been observed, which can play an important role in minimizing resistance difference for the phase-change memory cell element arrays.展开更多
Electric field control of magnetism through nanoionics has attracted tremendous attention owing to its high efficiency and low power consumption.In solid-state dielectrics,an electric field drives the redistribution o...Electric field control of magnetism through nanoionics has attracted tremendous attention owing to its high efficiency and low power consumption.In solid-state dielectrics,an electric field drives the redistribution of ions to create onedimensional magnetic conductive nanostructures,enabling the realization of intriguing magnetoresistance(MR)effects.Here,we explored the electric-controlled nickel and oxygen ion migration in Pt/HfO_(2-x)/NiO_(y)/Ni heterojunctions for MR modulation.By adjusting the voltage polarity and amplitude,the magnetic conductive filaments with mixed nickel and oxygen vacancy are constructed.This results in the reduction of device resistance by~10^(3)folds,and leads to an intriguing partial asymmetric MR effect.We show that the difference of the device resistance under positive and negative saturation magnetic fields exhibits good linear dependence on the magnetic field angle,which can be used for magnetic field direction detection.Our study suggests the potential of electrically controlled ion migration in creating novel magnetic nanostructures for sensor applications.展开更多
Electric-field control of perpendicular magnetic anisotropy(PMA) is a feasible way to manipulate perpendicular magnetization,which is of great importance for realizing energy-efficient spintronics.Here,we propose a no...Electric-field control of perpendicular magnetic anisotropy(PMA) is a feasible way to manipulate perpendicular magnetization,which is of great importance for realizing energy-efficient spintronics.Here,we propose a novel approach to accomplish this task at room temperature by resistive switching(RS) via electrochemical metallization(ECM) in a device with the stack of Si/SiO_(2)/Ta/Pt/Ag/Mn-doped ZnO(MZO)/Pt/Co/Pt/ITO.By applying certain voltages,the device could be set at high-resistance-state(HRS) and low-resistance-state(LRS),accompanied with a larger and a smaller coercivity(H_(C)),respectively,which demonstrates a nonvolatile E-field control of PMA.Based on our previous studies and the present control experiments,the electric modulation of PMA can be briefly explained as follows.At LRS,the Ag conductive filaments form and pass through the entire MZO layer and finally reach the Pt/Co/Pt sandwich,leading to weakening of PMA and reduction of H_(C).In contrast,at HRS,most of the Ag filaments dissolve and leave away from the Pt/Co/Pt sandwich,causing partial recovery of PMA and an increase of H_(C).This work provides a new clue to designing low-power spintronic devices based on PMA films.展开更多
Artificial intelligence(AI)processes data-centric applications with minimal effort.However,it poses new challenges to system design in terms of computational speed and energy efficiency.The traditional von Neumann arc...Artificial intelligence(AI)processes data-centric applications with minimal effort.However,it poses new challenges to system design in terms of computational speed and energy efficiency.The traditional von Neumann architecture cannot meet the requirements of heavily datacentric applications due to the separation of computation and storage.The emergence of computing inmemory(CIM)is significant in circumventing the von Neumann bottleneck.A commercialized memory architecture,static random-access memory(SRAM),is fast and robust,consumes less power,and is compatible with state-of-the-art technology.This study investigates the research progress of SRAM-based CIM technology in three levels:circuit,function,and application.It also outlines the problems,challenges,and prospects of SRAM-based CIM macros.展开更多
We report the experimental phenomenon of large resistance change in plasma oxidized TiOx/TiNx film fabricated on W bottom-electrode-contact （W-BEC） array. The W-BEC in diameter 26Ohm is fabricated by a 0.18μm CMOS ...We report the experimental phenomenon of large resistance change in plasma oxidized TiOx/TiNx film fabricated on W bottom-electrode-contact （W-BEC） array. The W-BEC in diameter 26Ohm is fabricated by a 0.18μm CMOS technology, and the TiOx/TiNx cell array is formed by rf magnetron sputtering and reactive ion etching. In current-voltage （I- V） measurement for current-sweeping mode, large snap-back of voltage is observed, which indicates that the sample changes from high-resistance state （HRS） to low-resistance state （LRS）. In the I-V measurement for voltage-sweeping mode, large current collapse is observed, which indicates that the sample changes from LRS to HRS. The current difference between HRS and LRS is about two orders. The threshold current and voltage for the resistance change is about 5.0- 10^-5 A and 2.5 V, respectively. The pulse voltage can also change the resistance and the pulse time is as shorter as 30 ns for the resistance change. These properties of TiOx/TiNx film are comparable to that of conventional phase-change material, which makes it possible for RRAM application.展开更多
Phase change memory （PCM） cell array is fabricated by a standard complementary metal-oxide-semiconductor process and the subsequent special fabrication technique. A chalcogenide Ge2Sb2Te5 film in thickness 50hm depo...Phase change memory （PCM） cell array is fabricated by a standard complementary metal-oxide-semiconductor process and the subsequent special fabrication technique. A chalcogenide Ge2Sb2Te5 film in thickness 50hm deposited by rf magnetron sputtering is used as storage medium for the PCM cell. Large snap-back effect is observed in current-voltage characteristics, indicating the phase transition from an amorphous state （higher resistance state） to the crystalline state （lower resistance state）. The resistance of amorphous state is two orders of magnitude larger than that of the crystalline state from the resistance measurement, and the threshold current needed for phase transition of our fabricated PCM cell array is very low （only several μA）. An x-ray total dose radiation test is carried out on the PCM cell array and the results show that this kind of PCM cell has excellent total dose radiation tolerance with total dose up to 2 ×10^6 rad（Si）, which makes it attractive for space-based applications.展开更多
Nano-scale Hf/HfO2-based resistive random-access-memory （RRAM） devices were fabricated. The cross-over between top and bottom electrodes of RRAM forms the metal-insulator-metal sandwich structure. The electrical res...Nano-scale Hf/HfO2-based resistive random-access-memory （RRAM） devices were fabricated. The cross-over between top and bottom electrodes of RRAM forms the metal-insulator-metal sandwich structure. The electrical responses of RRAM are studied in detail, including forming process, SET process and RESET process. The correlations between SET voltage and RESET voltage, high resistance state and low resistance state are dis- cussed. The electrical characteristics of RRAM are in a strong relationship with the compliance current in the SET process. The conduction mechanism ofnano-scale Hf/HfO2-based RRAM can be explained by the quantum point contact model.展开更多
The multiple-state storage capability of phase change memory （PCM） is confirmed by using stacked chalcogenide films as the storage medium. The current-voltage characteristics and the resistance-current characteristi...The multiple-state storage capability of phase change memory （PCM） is confirmed by using stacked chalcogenide films as the storage medium. The current-voltage characteristics and the resistance-current characteristics of the PCM clearly indicate that four states can be stored in this stacked film structure. Qualitative analysis indicates that the multiple-state storage capability of this stacked film structure is due to successive crystallizations in different Si-Sb-Te layers triggered by different amplitude currents.展开更多
A dual double interlocked storage cell(DICE)interleaving layout static random-access memory(SRAM)is designed and manufactured based on 65 nm bulk complementary metal oxide semiconductor technology.The single event ups...A dual double interlocked storage cell(DICE)interleaving layout static random-access memory(SRAM)is designed and manufactured based on 65 nm bulk complementary metal oxide semiconductor technology.The single event upset(SEU)cross sections of this memory are obtained via heavy ion irradiation with a linear energy transfer(LET)value ranging from 1.7 to 83.4 MeV/(mg/cm^(2)).Experimental results show that the upset threshold(LETth)of a 4 KB block is approximately 6 MeV/(mg/cm^(2)),which is much better than that of a standard unhardened SRAM with an identical technology node.A 1 KB block has a higher LETth of 25 MeV/(mg/cm^(2))owing to the use of the error detection and correction(EDAC)code.For a Ta ion irradiation test with the highest LET value(83.4 MeV/(mg/cm^(2))),the benefit of the EDAC code is reduced significantly because the multi-bit upset proportion in the SEU is increased remarkably.Compared with normal incident ions,the memory exhibits a higher SEU sensitivity in the tilt angle irradiation test.Moreover,the SEU cross section indicates a significant dependence on the data pattern.When comprehensively considering HSPICE simulation results and the sensitive area distributions of the DICE cell,it is shown that the data pattern dependence is primarily associated with the arrangement of sensitive transistor pairs in the layout.Finally,some suggestions are provided to further improve the radiation resistance of the memory.By implementing a particular design at the layout level,the SEU tolerance of the memory is improved significantly at a low area cost.Therefore,the designed 65 nm SRAM is suitable for electronic systems operating in serious radiation environments.展开更多
DRAM-based memory suffers from increasing row buffer conflicts,which causes significant performance degradation and power consumption.As memory capacity increases,the overheads of the row buffer conflict are increasin...DRAM-based memory suffers from increasing row buffer conflicts,which causes significant performance degradation and power consumption.As memory capacity increases,the overheads of the row buffer conflict are increasingly worse as increasing bitline length,which results in high row activation and precharge latencies.In this work,we propose a practical approach called Row Buffer Cache(RBC)to mitigate row buffer conflict overheads efficiently.At the core of our proposed RBC architecture,the rows with good spatial locality are cached and protected,which are exempted from being interrupted by the accesses for rows with poor locality.Such an RBC architecture significantly reduces the overheads of performance and energy caused by row activation and precharge,and thus improves overall system performance and energy efficiency.We evaluate RBC architecture using SPEC CPU2006 on a DDR4 memory compared to a commodity baseline memory system.Results show that RBC improves the overall performance by up to 2:24(16:1%on average)and reduces the memory energy by up to 68:2%(23:6%on average)for single-core simulations.For multi-core simulations,RBC increases the overall performance by up to1:55(17%on average)and reduces memory energy consumption by up to 35:4%(21:3%on average).展开更多
基金supported by the National Natural Science Foundation of China(Nos.12105341 and 12035019)the opening fund of Key Laboratory of Silicon Device and Technology,Chinese Academy of Sciences(No.KLSDTJJ2022-3).
文摘The 28 nm process has a high cost-performance ratio and has gradually become the standard for the field of radiation-hardened devices.However,owing to the minimum physical gate length of only 35 nm,the physical area of a standard 6T SRAM unit is approximately 0.16μm^(2),resulting in a significant enhancement of multi-cell charge-sharing effects.Multiple-cell upsets(MCUs)have become the primary physical mechanism behind single-event upsets(SEUs)in advanced nanometer node devices.The range of ionization track effects increases with higher ion energies,and spacecraft in orbit primarily experience SEUs caused by high-energy ions.However,ground accelerator experiments have mainly obtained low-energy ion irradiation data.Therefore,the impact of ion energy on the SEU cross section,charge collection mechanisms,and MCU patterns and quantities in advanced nanometer devices remains unclear.In this study,based on the experimental platform of the Heavy Ion Research Facility in Lanzhou,low-and high-energy heavy-ion beams were used to study the SEUs of 28 nm SRAM devices.The influence of ion energy on the charge collection processes of small-sensitive-volume devices,MCU patterns,and upset cross sections was obtained,and the applicable range of the inverse cosine law was clarified.The findings of this study are an important guide for the accurate evaluation of SEUs in advanced nanometer devices and for the development of radiation-hardening techniques.
基金supported by the National Natural Science Foundation of China (Grant Nos. 2032165 and 62004158)the National Key Scientific Instrument and Equipment Development Project of China (Grant No. 52127817)+1 种基金the State Key Laboratory of Particle Detection and Electronics (Grant Nos. SKLPDE-ZZ-201801 and SKLPDE-ZZ-202008)the Special Funds for Science and Technology Innovation Strategy of Guangdong Province, China (Grant No. 2018A0303130030)。
文摘To predict the soft error rate for applications, it is essential to study the energy dependence of the single-event-upset(SEU) cross-section. In this work, we present a direct measurement of the SEU cross-section with the Back-n white neutron source at the China Spallation Neutron Source. The measured cross section is consistent with the soft error data from the manufacturer and the result suggests that the threshold energy of the SEU is about 0.5 Me V, which confirms the statement in Iwashita’s report that the threshold energy for neutron soft error is much below that of the(n, α) cross-section of silicon.In addition, an index of the effective neutron energy is suggested to characterize the similarity between a spallation neutron beam and the standard atmospheric neutron environment.
基金partially supported by the National Natural Science Foundation of China(92064008)the CCF-Huawei Huyanglin Project CCF-HuaweiST2021002+1 种基金the Open Project Program of Wuhan National Laboratory for Optoelectronics(2022WNLOKF018)the Shandong Provincial Natural Science Foundation(ZR2022LZH010).
文摘Resistive Random-Access Memory(ReRAM)based Processing-in-Memory(PIM)frameworks are proposed to accelerate the working process of DNN models by eliminating the data movement between the computing and memory units.To further mitigate the space and energy consumption,DNN model weight sparsity and weight pattern repetition are exploited to optimize these ReRAM-based accelerators.However,most of these works only focus on one aspect of this software/hardware codesign framework and optimize them individually,which makes the design far from optimal.In this paper,we propose PRAP-PIM,which jointly exploits the weight sparsity and weight pattern repetition by using a weight pattern reusing aware pruning method.By relaxing the weight pattern reusing precondition,we propose a similarity-based weight pattern reusing method that can achieve a higher weight pattern reusing ratio.Experimental results show that PRAP-PIM achieves 1.64×performance improvement and 1.51×energy efficiency improvement in popular deep learning benchmarks,compared with the state-of-the-art ReRAM-based DNN accelerators.
文摘Sn-doped Ge2Sb2Te5 thin films deposited on Si（100）/SiO2 substrates by rf magnetron sputtering are investigated by a differential scanning calorimeter, x-ray diffraction and sheet resistance measurement. The crystallization temperatures of the 3.58 at.%, 6.92 at.% and 10.04 at.% Sn-doped Ge2Sb2Te5 thin films have decreases of 5.3, 6.1 and 0.9℃, respectively, which is beneficial to reduce the switching current for the amorphous-to-crystalline phase transition. Due to Sn-doping, the sheet resistance of crystalline Ge2Sb2Te5 thin films increases about 2-10 times, which may be useful to reduce the switching current for the amorphous-to-crystalline phase change. In addition, an obvious decreasing dispersibility for the sheet resistance of Sn-doped Ge2Sb2Te5 thin films in the crystalline state has been observed, which can play an important role in minimizing resistance difference for the phase-change memory cell element arrays.
基金Project supported by the National Key Research and Development Program of China(Grant No.2021YFA1202600)the National Natural Science Foundation of China(Grant Nos.92064011,62174164,61974179,and 61674153)+3 种基金Youth Innovation Promotion Association of the CAS(Grant No.2020297)Natural Science Foundation of Zhejiang Province(Grant No.LR17E020001)Ningbo Natural Science Foundation(Grant No.202003N4029)C.Wong Education Foundation(Grant No.GJTD-2020-11)。
文摘Electric field control of magnetism through nanoionics has attracted tremendous attention owing to its high efficiency and low power consumption.In solid-state dielectrics,an electric field drives the redistribution of ions to create onedimensional magnetic conductive nanostructures,enabling the realization of intriguing magnetoresistance(MR)effects.Here,we explored the electric-controlled nickel and oxygen ion migration in Pt/HfO_(2-x)/NiO_(y)/Ni heterojunctions for MR modulation.By adjusting the voltage polarity and amplitude,the magnetic conductive filaments with mixed nickel and oxygen vacancy are constructed.This results in the reduction of device resistance by~10^(3)folds,and leads to an intriguing partial asymmetric MR effect.We show that the difference of the device resistance under positive and negative saturation magnetic fields exhibits good linear dependence on the magnetic field angle,which can be used for magnetic field direction detection.Our study suggests the potential of electrically controlled ion migration in creating novel magnetic nanostructures for sensor applications.
基金Project supported by the National Key Research and Development Program of China (Grant No. 2022YFA1403602)the National Natural Science Foundation of China (Grant Nos. 51971109, 52025012, and 52001169)。
文摘Electric-field control of perpendicular magnetic anisotropy(PMA) is a feasible way to manipulate perpendicular magnetization,which is of great importance for realizing energy-efficient spintronics.Here,we propose a novel approach to accomplish this task at room temperature by resistive switching(RS) via electrochemical metallization(ECM) in a device with the stack of Si/SiO_(2)/Ta/Pt/Ag/Mn-doped ZnO(MZO)/Pt/Co/Pt/ITO.By applying certain voltages,the device could be set at high-resistance-state(HRS) and low-resistance-state(LRS),accompanied with a larger and a smaller coercivity(H_(C)),respectively,which demonstrates a nonvolatile E-field control of PMA.Based on our previous studies and the present control experiments,the electric modulation of PMA can be briefly explained as follows.At LRS,the Ag conductive filaments form and pass through the entire MZO layer and finally reach the Pt/Co/Pt sandwich,leading to weakening of PMA and reduction of H_(C).In contrast,at HRS,most of the Ag filaments dissolve and leave away from the Pt/Co/Pt sandwich,causing partial recovery of PMA and an increase of H_(C).This work provides a new clue to designing low-power spintronic devices based on PMA films.
基金the National Key Research and Development Program of China(2018YFB2202602)The State Key Program of the National Natural Science Foundation of China(NO.61934005)+1 种基金The National Natural Science Foundation of China(NO.62074001)Joint Funds of the National Natural Science Foundation of China under Grant U19A2074.
文摘Artificial intelligence(AI)processes data-centric applications with minimal effort.However,it poses new challenges to system design in terms of computational speed and energy efficiency.The traditional von Neumann architecture cannot meet the requirements of heavily datacentric applications due to the separation of computation and storage.The emergence of computing inmemory(CIM)is significant in circumventing the von Neumann bottleneck.A commercialized memory architecture,static random-access memory(SRAM),is fast and robust,consumes less power,and is compatible with state-of-the-art technology.This study investigates the research progress of SRAM-based CIM technology in three levels:circuit,function,and application.It also outlines the problems,challenges,and prospects of SRAM-based CIM macros.
基金Supported by the National Basic Research Program of China under Grant No 2006CB302700, the National High Technology Development Programme of China under Grant No 2006AA03Z360~ Chinese Academy of Sciences （Y2005027）, Science and Technology Council of Shanghai under Grant Nos AM0517, 05JC14076, 0552nm043, 06QA14060, 06XD14025, 0652nm003, and 06DZ22017, the China Postdoctoral Science Foundation, and the K. C. Wong Education Foundation （Hong Kong）.
文摘We report the experimental phenomenon of large resistance change in plasma oxidized TiOx/TiNx film fabricated on W bottom-electrode-contact （W-BEC） array. The W-BEC in diameter 26Ohm is fabricated by a 0.18μm CMOS technology, and the TiOx/TiNx cell array is formed by rf magnetron sputtering and reactive ion etching. In current-voltage （I- V） measurement for current-sweeping mode, large snap-back of voltage is observed, which indicates that the sample changes from high-resistance state （HRS） to low-resistance state （LRS）. In the I-V measurement for voltage-sweeping mode, large current collapse is observed, which indicates that the sample changes from LRS to HRS. The current difference between HRS and LRS is about two orders. The threshold current and voltage for the resistance change is about 5.0- 10^-5 A and 2.5 V, respectively. The pulse voltage can also change the resistance and the pulse time is as shorter as 30 ns for the resistance change. These properties of TiOx/TiNx film are comparable to that of conventional phase-change material, which makes it possible for RRAM application.
基金Supported by the Chinese Academy of Sciences （Y2005027）, the Science and Technology Council of Shanghai （AM0517, 0452nm012, 04DZ05612, 04ZR14154, 04JC14080, 05JC14076, AM0414, 05nm05043）, the China Postdoctoral Science Foundation, and the K. C. Wong Education Foundation （Hong Kong）.
文摘Phase change memory （PCM） cell array is fabricated by a standard complementary metal-oxide-semiconductor process and the subsequent special fabrication technique. A chalcogenide Ge2Sb2Te5 film in thickness 50hm deposited by rf magnetron sputtering is used as storage medium for the PCM cell. Large snap-back effect is observed in current-voltage characteristics, indicating the phase transition from an amorphous state （higher resistance state） to the crystalline state （lower resistance state）. The resistance of amorphous state is two orders of magnitude larger than that of the crystalline state from the resistance measurement, and the threshold current needed for phase transition of our fabricated PCM cell array is very low （only several μA）. An x-ray total dose radiation test is carried out on the PCM cell array and the results show that this kind of PCM cell has excellent total dose radiation tolerance with total dose up to 2 ×10^6 rad（Si）, which makes it attractive for space-based applications.
基金Project supported by the National Natural Science Foundation of China(Nos.11179003,61176095)
文摘Nano-scale Hf/HfO2-based resistive random-access-memory （RRAM） devices were fabricated. The cross-over between top and bottom electrodes of RRAM forms the metal-insulator-metal sandwich structure. The electrical responses of RRAM are studied in detail, including forming process, SET process and RESET process. The correlations between SET voltage and RESET voltage, high resistance state and low resistance state are dis- cussed. The electrical characteristics of RRAM are in a strong relationship with the compliance current in the SET process. The conduction mechanism ofnano-scale Hf/HfO2-based RRAM can be explained by the quantum point contact model.
文摘The multiple-state storage capability of phase change memory （PCM） is confirmed by using stacked chalcogenide films as the storage medium. The current-voltage characteristics and the resistance-current characteristics of the PCM clearly indicate that four states can be stored in this stacked film structure. Qualitative analysis indicates that the multiple-state storage capability of this stacked film structure is due to successive crystallizations in different Si-Sb-Te layers triggered by different amplitude currents.
基金the National Natural Science Foundation of China(Nos.12035019,11690041,and 11805244).
文摘A dual double interlocked storage cell(DICE)interleaving layout static random-access memory(SRAM)is designed and manufactured based on 65 nm bulk complementary metal oxide semiconductor technology.The single event upset(SEU)cross sections of this memory are obtained via heavy ion irradiation with a linear energy transfer(LET)value ranging from 1.7 to 83.4 MeV/(mg/cm^(2)).Experimental results show that the upset threshold(LETth)of a 4 KB block is approximately 6 MeV/(mg/cm^(2)),which is much better than that of a standard unhardened SRAM with an identical technology node.A 1 KB block has a higher LETth of 25 MeV/(mg/cm^(2))owing to the use of the error detection and correction(EDAC)code.For a Ta ion irradiation test with the highest LET value(83.4 MeV/(mg/cm^(2))),the benefit of the EDAC code is reduced significantly because the multi-bit upset proportion in the SEU is increased remarkably.Compared with normal incident ions,the memory exhibits a higher SEU sensitivity in the tilt angle irradiation test.Moreover,the SEU cross section indicates a significant dependence on the data pattern.When comprehensively considering HSPICE simulation results and the sensitive area distributions of the DICE cell,it is shown that the data pattern dependence is primarily associated with the arrangement of sensitive transistor pairs in the layout.Finally,some suggestions are provided to further improve the radiation resistance of the memory.By implementing a particular design at the layout level,the SEU tolerance of the memory is improved significantly at a low area cost.Therefore,the designed 65 nm SRAM is suitable for electronic systems operating in serious radiation environments.
基金supported by the US National Science Foundation(Nos.CCF-1717660 and CNS-1828363)。
文摘DRAM-based memory suffers from increasing row buffer conflicts,which causes significant performance degradation and power consumption.As memory capacity increases,the overheads of the row buffer conflict are increasingly worse as increasing bitline length,which results in high row activation and precharge latencies.In this work,we propose a practical approach called Row Buffer Cache(RBC)to mitigate row buffer conflict overheads efficiently.At the core of our proposed RBC architecture,the rows with good spatial locality are cached and protected,which are exempted from being interrupted by the accesses for rows with poor locality.Such an RBC architecture significantly reduces the overheads of performance and energy caused by row activation and precharge,and thus improves overall system performance and energy efficiency.We evaluate RBC architecture using SPEC CPU2006 on a DDR4 memory compared to a commodity baseline memory system.Results show that RBC improves the overall performance by up to 2:24(16:1%on average)and reduces the memory energy by up to 68:2%(23:6%on average)for single-core simulations.For multi-core simulations,RBC increases the overall performance by up to1:55(17%on average)and reduces memory energy consumption by up to 35:4%(21:3%on average).
