Pulsed laser welding was used in joining pure aluminum to stainless steel in a lap joint configuration. It is found that the mechanical properties of the laser joints were closely correlated with the bead geometry, i....Pulsed laser welding was used in joining pure aluminum to stainless steel in a lap joint configuration. It is found that the mechanical properties of the laser joints were closely correlated with the bead geometry, i.e., penetration depth. In order to study the correlation, two typical laser welds with different penetration depths were analyzed. In high penetration depth (354 μm) joint, Al-rich Fe?Al IMCs with microcracks were formed at the Al/fusion zone (FZ) interface. The joint strength was found to be (27.2±1.7) N/mm and three failure modes were observed near the Al/FZ interface. In low penetration depth (108 μm) joint, Fe-rich Fe?Al IMCs without any defect were formed at the Al/FZ interface. The joint strength was found to be (46.2±1.9) N/mm and one failure mode was observed across the FZ.展开更多
We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it...We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.展开更多
基金Project(51265035)supported by the National Natural Science Foundation of ChinaProject(20151BAB206042)supported by the Natural Science Foundation of Jiangxi Province,ChinaProject(GJJ150020)supported by the Jiangxi Provincial Department of Education,China
文摘Pulsed laser welding was used in joining pure aluminum to stainless steel in a lap joint configuration. It is found that the mechanical properties of the laser joints were closely correlated with the bead geometry, i.e., penetration depth. In order to study the correlation, two typical laser welds with different penetration depths were analyzed. In high penetration depth (354 μm) joint, Al-rich Fe?Al IMCs with microcracks were formed at the Al/fusion zone (FZ) interface. The joint strength was found to be (27.2±1.7) N/mm and three failure modes were observed near the Al/FZ interface. In low penetration depth (108 μm) joint, Fe-rich Fe?Al IMCs without any defect were formed at the Al/FZ interface. The joint strength was found to be (46.2±1.9) N/mm and one failure mode was observed across the FZ.
文摘We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.
