基于奇异值分解(singular value decomposition,SVD)和最小二乘支持向量机(least square support vector machine,LS-SVM)提出电能质量扰动类型识别的新方法。通过对电能质量扰动信号的小波包变换系数矩阵进行奇异值分解,将基频、扰动...基于奇异值分解(singular value decomposition,SVD)和最小二乘支持向量机(least square support vector machine,LS-SVM)提出电能质量扰动类型识别的新方法。通过对电能质量扰动信号的小波包变换系数矩阵进行奇异值分解,将基频、扰动频率分量、噪声分解到不同的正交特征子空间。再与正常电压信号的奇异值作比值以抵消噪声能量的影响,最大限度地体现出扰动类型间的细微差别,以此作为扰动特征向量,作为最小二乘支持向量机分类器的输入参数,来实现电能质量扰动类型的识别。仿真结果表明,该方法识别准确率高,受噪声影响小,算法稳定性好。展开更多
Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple stake...Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.展开更多
文摘基于奇异值分解(singular value decomposition,SVD)和最小二乘支持向量机(least square support vector machine,LS-SVM)提出电能质量扰动类型识别的新方法。通过对电能质量扰动信号的小波包变换系数矩阵进行奇异值分解,将基频、扰动频率分量、噪声分解到不同的正交特征子空间。再与正常电压信号的奇异值作比值以抵消噪声能量的影响,最大限度地体现出扰动类型间的细微差别,以此作为扰动特征向量,作为最小二乘支持向量机分类器的输入参数,来实现电能质量扰动类型的识别。仿真结果表明,该方法识别准确率高,受噪声影响小,算法稳定性好。
基金supported in part by National Key R&D Program of China (2021YFB2500600)CAS Youth multi-discipline project (JCTD-2021-09)Strategic Piority Research Program of Chinese Academy of Sciences (XDA28040100)。
文摘Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.
