针对安全视频监控系统(Security Video monitor System,简称SVMS)中非屏蔽双绞线(UTP)电缆远距离传输的视频信号损耗补偿需求,提出了利用自适应均衡器MAX7474来补偿UTP中衰减复合视频信号的应用方案。简要介绍了MAX7474器件的功能及其...针对安全视频监控系统(Security Video monitor System,简称SVMS)中非屏蔽双绞线(UTP)电缆远距离传输的视频信号损耗补偿需求,提出了利用自适应均衡器MAX7474来补偿UTP中衰减复合视频信号的应用方案。简要介绍了MAX7474器件的功能及其内部结构;给出了在MAX7474的基础上构建UTP视频信号补偿电路的一个应用实例。经实验证明,该方案中的电路工作稳定,对衰减后的视频信号具有良好的补偿性能。展开更多
Thickness deposition is a crucial issue on the application of electroformed micro mold inserts. Edge concentration effect is the main source of the non-uniformity. The techniques of adopting a non-conducting shield, a...Thickness deposition is a crucial issue on the application of electroformed micro mold inserts. Edge concentration effect is the main source of the non-uniformity. The techniques of adopting a non-conducting shield, a secondary electrode and a movable cathode were explored to improve the thickness deposition uniformity during the nickel electroforming process. Regarding these techniques, a micro electroforming system with a movable cathode was particularly developed. The thickness variation of a 16 mm×16 mm electroformed sample decreased respectively from 150% to 35%, 12% and 18% by these three techniques. Combining these validated methods, anickelmold insert for microlens array was electroformed with satisfactory mechanical properties and high replication precision. It could be applied to the following injection molding process.展开更多
文摘针对安全视频监控系统(Security Video monitor System,简称SVMS)中非屏蔽双绞线(UTP)电缆远距离传输的视频信号损耗补偿需求,提出了利用自适应均衡器MAX7474来补偿UTP中衰减复合视频信号的应用方案。简要介绍了MAX7474器件的功能及其内部结构;给出了在MAX7474的基础上构建UTP视频信号补偿电路的一个应用实例。经实验证明,该方案中的电路工作稳定,对衰减后的视频信号具有良好的补偿性能。
基金Projects(51305465,91123012)supported by the National Natural Science Foundation of China
文摘Thickness deposition is a crucial issue on the application of electroformed micro mold inserts. Edge concentration effect is the main source of the non-uniformity. The techniques of adopting a non-conducting shield, a secondary electrode and a movable cathode were explored to improve the thickness deposition uniformity during the nickel electroforming process. Regarding these techniques, a micro electroforming system with a movable cathode was particularly developed. The thickness variation of a 16 mm×16 mm electroformed sample decreased respectively from 150% to 35%, 12% and 18% by these three techniques. Combining these validated methods, anickelmold insert for microlens array was electroformed with satisfactory mechanical properties and high replication precision. It could be applied to the following injection molding process.
