Based on the theoretical and experimental investigation of a thin silicon layer（TSL） with linear variable doping（LVD） and further research on the TSL LVD with a multiple step field plate（MSFP）,a breakdown voltag...Based on the theoretical and experimental investigation of a thin silicon layer（TSL） with linear variable doping（LVD） and further research on the TSL LVD with a multiple step field plate（MSFP）,a breakdown voltage（BV） model is proposed and experimentally verified in this paper.With the two-dimensional Poisson equation of the silicon on insulator（SOI） device,the lateral electric field in drift region of the thin silicon layer is assumed to be constant.For the SOI device with LVD in the thin silicon layer,the dependence of the BV on impurity concentration under the drain is investigated by an enhanced dielectric layer field（ENDIF）,from which the reduced surface field（RESURF） condition is deduced.The drain in the centre of the device has a good self-isolation effect,but the problem of the high voltage interconnection（HVI） line will become serious.The two step field plates including the source field plate and gate field plate can be adopted to shield the HVI adverse effect on the device.Based on this model,the TSL LVD SOI n-channel lateral double-diffused MOSFET（nLDMOS） with MSFP is realized.The experimental breakdown voltage（BV） and specific on-resistance（R on,sp） of the TSL LVD SOI device are 694 V and 21.3 ·mm 2 with a drift region length of 60 μm,buried oxide layer of 3 μm,and silicon layer of 0.15 μm,respectively.展开更多
基于介质场增强(ENDIF)理论,提出了一种部分超结型薄硅层SOI横向绝缘栅双极型晶体管(PSJ SOI LIGBT)。分析了漂移区注入剂量和超结区域位置对器件耐压性能的影响,并在工艺流程中结合线性变掺杂技术和超结技术,使该器件实现了高垂直方向...基于介质场增强(ENDIF)理论,提出了一种部分超结型薄硅层SOI横向绝缘栅双极型晶体管(PSJ SOI LIGBT)。分析了漂移区注入剂量和超结区域位置对器件耐压性能的影响,并在工艺流程中结合线性变掺杂技术和超结技术,使该器件实现了高垂直方向耐压和低导通电阻。测试结果表明,该器件的耐压达到816 V,比导通电阻仅为12.5Ω·mm^(2)。展开更多
基金Project supported partially by the National Natural Science Foundation of China (Grant Nos. 60906038 and 61076082)
文摘Based on the theoretical and experimental investigation of a thin silicon layer（TSL） with linear variable doping（LVD） and further research on the TSL LVD with a multiple step field plate（MSFP）,a breakdown voltage（BV） model is proposed and experimentally verified in this paper.With the two-dimensional Poisson equation of the silicon on insulator（SOI） device,the lateral electric field in drift region of the thin silicon layer is assumed to be constant.For the SOI device with LVD in the thin silicon layer,the dependence of the BV on impurity concentration under the drain is investigated by an enhanced dielectric layer field（ENDIF）,from which the reduced surface field（RESURF） condition is deduced.The drain in the centre of the device has a good self-isolation effect,but the problem of the high voltage interconnection（HVI） line will become serious.The two step field plates including the source field plate and gate field plate can be adopted to shield the HVI adverse effect on the device.Based on this model,the TSL LVD SOI n-channel lateral double-diffused MOSFET（nLDMOS） with MSFP is realized.The experimental breakdown voltage（BV） and specific on-resistance（R on,sp） of the TSL LVD SOI device are 694 V and 21.3 ·mm 2 with a drift region length of 60 μm,buried oxide layer of 3 μm,and silicon layer of 0.15 μm,respectively.
文摘基于介质场增强(ENDIF)理论,提出了一种部分超结型薄硅层SOI横向绝缘栅双极型晶体管(PSJ SOI LIGBT)。分析了漂移区注入剂量和超结区域位置对器件耐压性能的影响,并在工艺流程中结合线性变掺杂技术和超结技术,使该器件实现了高垂直方向耐压和低导通电阻。测试结果表明,该器件的耐压达到816 V,比导通电阻仅为12.5Ω·mm^(2)。
