采用双层硅胶加盖不锈钢材质层压板的层压方法制备功率型低温共烧铁氧体(LTCF)变压器。通过断面显微结构、电感值及耐压的测试,研究了层压方法对其结构及性能的影响。结果表明,相对于传统的层压方法,新方法制作的变压器层压受力均匀、...采用双层硅胶加盖不锈钢材质层压板的层压方法制备功率型低温共烧铁氧体(LTCF)变压器。通过断面显微结构、电感值及耐压的测试,研究了层压方法对其结构及性能的影响。结果表明,相对于传统的层压方法,新方法制作的变压器层压受力均匀、表面不平整度≤±5μm/10 mm,无凸起、分层,排胶烧结过程中未出现开裂、翘曲等缺陷,显微结构理想。变压器性能为,初级电感:≥60μH、次级电感:≥2.6 m H、漏感:≤35μH、耐压:≥1500V(DC),且满足高低温应用环境(-55^+85℃)下磁性能使用可靠性和环境适应性要求。展开更多
In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmeg...In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.展开更多
文摘采用双层硅胶加盖不锈钢材质层压板的层压方法制备功率型低温共烧铁氧体(LTCF)变压器。通过断面显微结构、电感值及耐压的测试,研究了层压方法对其结构及性能的影响。结果表明,相对于传统的层压方法,新方法制作的变压器层压受力均匀、表面不平整度≤±5μm/10 mm,无凸起、分层,排胶烧结过程中未出现开裂、翘曲等缺陷,显微结构理想。变压器性能为,初级电感:≥60μH、次级电感:≥2.6 m H、漏感:≤35μH、耐压:≥1500V(DC),且满足高低温应用环境(-55^+85℃)下磁性能使用可靠性和环境适应性要求。
基金Project(041010) supported by Start-Up Foundation of Northwest University,ChinaProject(UIT/39) supported by University-Industry Collaboration Program from the Innovation and Technology Fund of Hong Kong,China
文摘In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.
