The depth and nature of the subsurface damage in a silicon wafer will limit the performance of IC components. Damage microstructures of the silicon wafers ground by the #325, #600, and #2000 grinding wheels was analyz...The depth and nature of the subsurface damage in a silicon wafer will limit the performance of IC components. Damage microstructures of the silicon wafers ground by the #325, #600, and #2000 grinding wheels was analyzed. The results show that many microcracks, fractures, and dislocation rosettes appear in the surface and subsurface of the wafer ground by the #325 grinding wheel. No obvious microstructure change exists. The amorphous layer with a thickness of about 100 nm, microcracks, high density dislocations, and polycrystalline silicon are observed in the subsurface of the wafer ground by the #600 grinding wheel. For the wafer ground by the #2000 grinding wheel, an amorphous layer of about 30 nm thickness, a polycrystalline silicon layer, a few dislocations, and an elastic deformation layer exist. In general, with the decrease in grit size, the material removal mode changes from micro-fracture mode to ductile mode gradually.展开更多
Fiber-reinforced composites have become the preferred material in the fields of aviation and aerospace because of their high-strength performance in unit weight.The composite components are manufactured by near netsha...Fiber-reinforced composites have become the preferred material in the fields of aviation and aerospace because of their high-strength performance in unit weight.The composite components are manufactured by near netshape and only require finishing operations to achieve final dimensional and assembly tolerances.Milling and grinding arise as the preferred choices because of their precision processing.Nevertheless,given their laminated,anisotropic,and heterogeneous nature,these materials are considered difficult-to-machine.As undesirable results and challenging breakthroughs,the surface damage and integrity of these materials is a research hotspot with important engineering significance.This review summarizes an up-to-date progress of the damage formation mechanisms and suppression strategies in milling and grinding for the fiber-reinforced composites reported in the literature.First,the formation mechanisms of milling damage,including delamination,burr,and tear,are analyzed.Second,the grinding mechanisms,covering material removal mechanism,thermal mechanical behavior,surface integrity,and damage,are discussed.Third,suppression strategies are reviewed systematically from the aspects of advanced cutting tools and technologies,including ultrasonic vibration-assisted machining,cryogenic cooling,minimum quantity lubrication(MQL),and tool optimization design.Ultrasonic vibration shows the greatest advantage of restraining machining force,which can be reduced by approximately 60%compared with conventional machining.Cryogenic cooling is the most effective method to reduce temperature with a maximum reduction of approximately 60%.MQL shows its advantages in terms of reducing friction coefficient,force,temperature,and tool wear.Finally,research gaps and future exploration directions are prospected,giving researchers opportunity to deepen specific aspects and explore new area for achieving high precision surface machining of fiber-reinforced composites.展开更多
As for the ultra-precision grinding of the hemispherical fused silica resonator,due to the hard and brittle nature of fused silica,subsurface damage(SSD)is easily generated,which enormously influences the performance ...As for the ultra-precision grinding of the hemispherical fused silica resonator,due to the hard and brittle nature of fused silica,subsurface damage(SSD)is easily generated,which enormously influences the performance of such components.Hence,ultra-precision grinding experiments are carried out to investigate the surface/subsurface quality of the hemispherical resonator machined by the small ball-end fine diamond grinding wheel.The influence of grinding parameters on the surface roughness(SR)and SSD depth of fused silica samples is then analyzed.The experimental results indicate that the SR and SSD depth decreased with the increase of grinding speed and the decrease of feed rate and grinding depth.In addition,based on the material strain rate and the maximum undeformed chip thickness,the effect of grinding parameters on the subsurface damage mechanism of fused silica samples is analyzed.Furthermore,a multi-step ultra-precision grinding technique of the hemispherical resonator is proposed based on the interaction influence between grinding depth and feed rate.Finally,the hemispherical resonator is processed by the proposed grinding technique,and the SR is improved from 454.328 nm to 110.449 nm while the SSD depth is reduced by 94%from 40μm to 2.379μm.The multi-step grinding technique proposed in this paper can guide the fabrication of the hemispherical resonator.展开更多
基金This study was financially supported by the National Natural Science Foundation of China in Major Project Program (No. 50390061)the National Science Fund for Distinguished Young Scholars (No. 50325518).
文摘The depth and nature of the subsurface damage in a silicon wafer will limit the performance of IC components. Damage microstructures of the silicon wafers ground by the #325, #600, and #2000 grinding wheels was analyzed. The results show that many microcracks, fractures, and dislocation rosettes appear in the surface and subsurface of the wafer ground by the #325 grinding wheel. No obvious microstructure change exists. The amorphous layer with a thickness of about 100 nm, microcracks, high density dislocations, and polycrystalline silicon are observed in the subsurface of the wafer ground by the #600 grinding wheel. For the wafer ground by the #2000 grinding wheel, an amorphous layer of about 30 nm thickness, a polycrystalline silicon layer, a few dislocations, and an elastic deformation layer exist. In general, with the decrease in grit size, the material removal mode changes from micro-fracture mode to ductile mode gradually.
基金the National Key R&D Program of China(Grant No.2020YFB2010500)the National Natural Science Foundation of China(Grant Nos.51975305 and 51905289)+2 种基金Shandong Natural Science Foundation,China(Grant Nos.ZR2020KE027 and ZR2020ME158)the Innovation Talent Supporting Program for Postdoctoral Fellows of Shandong Province,China(Grant No.SDBX2020012)the Major Science and Technology Innovation Engineering Projects of Shandong Province,China(Grant No.2019JZZY020111).
文摘Fiber-reinforced composites have become the preferred material in the fields of aviation and aerospace because of their high-strength performance in unit weight.The composite components are manufactured by near netshape and only require finishing operations to achieve final dimensional and assembly tolerances.Milling and grinding arise as the preferred choices because of their precision processing.Nevertheless,given their laminated,anisotropic,and heterogeneous nature,these materials are considered difficult-to-machine.As undesirable results and challenging breakthroughs,the surface damage and integrity of these materials is a research hotspot with important engineering significance.This review summarizes an up-to-date progress of the damage formation mechanisms and suppression strategies in milling and grinding for the fiber-reinforced composites reported in the literature.First,the formation mechanisms of milling damage,including delamination,burr,and tear,are analyzed.Second,the grinding mechanisms,covering material removal mechanism,thermal mechanical behavior,surface integrity,and damage,are discussed.Third,suppression strategies are reviewed systematically from the aspects of advanced cutting tools and technologies,including ultrasonic vibration-assisted machining,cryogenic cooling,minimum quantity lubrication(MQL),and tool optimization design.Ultrasonic vibration shows the greatest advantage of restraining machining force,which can be reduced by approximately 60%compared with conventional machining.Cryogenic cooling is the most effective method to reduce temperature with a maximum reduction of approximately 60%.MQL shows its advantages in terms of reducing friction coefficient,force,temperature,and tool wear.Finally,research gaps and future exploration directions are prospected,giving researchers opportunity to deepen specific aspects and explore new area for achieving high precision surface machining of fiber-reinforced composites.
基金This work was supported by the National Key Research and Development Program of China(No.2022YFB3403600)the National Natural Science Foundation of China(No.52293403)Self-Planned Task of State Key Laboratory of Robotics and System(HIT)(No.SKLRS202204C).
文摘As for the ultra-precision grinding of the hemispherical fused silica resonator,due to the hard and brittle nature of fused silica,subsurface damage(SSD)is easily generated,which enormously influences the performance of such components.Hence,ultra-precision grinding experiments are carried out to investigate the surface/subsurface quality of the hemispherical resonator machined by the small ball-end fine diamond grinding wheel.The influence of grinding parameters on the surface roughness(SR)and SSD depth of fused silica samples is then analyzed.The experimental results indicate that the SR and SSD depth decreased with the increase of grinding speed and the decrease of feed rate and grinding depth.In addition,based on the material strain rate and the maximum undeformed chip thickness,the effect of grinding parameters on the subsurface damage mechanism of fused silica samples is analyzed.Furthermore,a multi-step ultra-precision grinding technique of the hemispherical resonator is proposed based on the interaction influence between grinding depth and feed rate.Finally,the hemispherical resonator is processed by the proposed grinding technique,and the SR is improved from 454.328 nm to 110.449 nm while the SSD depth is reduced by 94%from 40μm to 2.379μm.The multi-step grinding technique proposed in this paper can guide the fabrication of the hemispherical resonator.
