Cu bump was transferred using a focused laser pulse for microelectronic packaging.An Nd:YAG laser pulse (maximum energy of 500 mJ;wavelength of 1064 nm;fluences of 0.4-2.1 kJ/cm2) was irradiated on a sacrificial absor...Cu bump was transferred using a focused laser pulse for microelectronic packaging.An Nd:YAG laser pulse (maximum energy of 500 mJ;wavelength of 1064 nm;fluences of 0.4-2.1 kJ/cm2) was irradiated on a sacrificial absorption layer with copper coating.The focused laser beam induced plasma between the semi-transparent donor slide and the sacrificial layer,causing a shock wave.The shock wave pressure pushed the Cu layer and transferred material to deposit a bump on substrate.A beam-shaper was used to produce uniform pressure at the interface to reduce fragmentation of the transferred material on the substrate.The calculated shock wave pressure with respect to laser fluence was 1-3 GPa.A Cu bump of diameter of 200 μm was successfully deposited at laser fluence of 0.6 kJ/cm 2.The pressure control at the sacrificial layer using a laser pulse was critical to produce a bump with less fragmentation.The technique can be applied to forming Cu bump for an interconnecting process in electronics.展开更多
扫描方式是激光金属沉积成形(Laser metal deposition shaping,LMDS)制造过程中的关键技术,在分析现有扫描方式及其对成形质量和成形效率影响的基础上,指出现有扫描方式的缺陷,并提出一种基于层面轮廓优化单调区分解的分区平行扫描方式...扫描方式是激光金属沉积成形(Laser metal deposition shaping,LMDS)制造过程中的关键技术,在分析现有扫描方式及其对成形质量和成形效率影响的基础上,指出现有扫描方式的缺陷,并提出一种基于层面轮廓优化单调区分解的分区平行扫描方式。该方式基于极值顶点可见性原理,对分层后的断面轮廓进行去除内环、非单调多边形的单调剖分等处理,可最大限度地减少分区数量,获得若干个单调子区域。针对各单调子区域采用适应性变间距平行路径填充,可减小扫描线的长度,并保证均匀致密性填充。试验表明这种扫描方式能够提高成形效率和成形质量。展开更多
基板预热可以显著降低激光金属沉积成形(laser metal deposition shaping,LMDS)过程的热应力,从而抑制成形过程裂缝的产生,但基板预热温度的高低对成形零件的微观组织有着重要的影响,因此研究不同基板预热温度下激光金属沉积成形零件的...基板预热可以显著降低激光金属沉积成形(laser metal deposition shaping,LMDS)过程的热应力,从而抑制成形过程裂缝的产生,但基板预热温度的高低对成形零件的微观组织有着重要的影响,因此研究不同基板预热温度下激光金属沉积成形零件的微观组织变化规律对基板预热温度的选择具有非常重要的意义.利用中国科学院沈阳自动化研究所自行研制的激光金属沉积成形系统和基板预热系统,采用Ni60A金属粉末在基板未预热和预热到200,300,400,500和600℃时分别进行成形试验.然后利用扫描电子显微镜和能量散射谱仪对成形试件的微观组织进行深入的研究,得到不同基板预热温度对激光金属沉积成形零件微观组织的影响规律,为基板预热温度的优化选择提供了重要参考.展开更多
基金Project(2012-0001900)supported by the National Research Foundation of Korea
文摘Cu bump was transferred using a focused laser pulse for microelectronic packaging.An Nd:YAG laser pulse (maximum energy of 500 mJ;wavelength of 1064 nm;fluences of 0.4-2.1 kJ/cm2) was irradiated on a sacrificial absorption layer with copper coating.The focused laser beam induced plasma between the semi-transparent donor slide and the sacrificial layer,causing a shock wave.The shock wave pressure pushed the Cu layer and transferred material to deposit a bump on substrate.A beam-shaper was used to produce uniform pressure at the interface to reduce fragmentation of the transferred material on the substrate.The calculated shock wave pressure with respect to laser fluence was 1-3 GPa.A Cu bump of diameter of 200 μm was successfully deposited at laser fluence of 0.6 kJ/cm 2.The pressure control at the sacrificial layer using a laser pulse was critical to produce a bump with less fragmentation.The technique can be applied to forming Cu bump for an interconnecting process in electronics.
文摘扫描方式是激光金属沉积成形(Laser metal deposition shaping,LMDS)制造过程中的关键技术,在分析现有扫描方式及其对成形质量和成形效率影响的基础上,指出现有扫描方式的缺陷,并提出一种基于层面轮廓优化单调区分解的分区平行扫描方式。该方式基于极值顶点可见性原理,对分层后的断面轮廓进行去除内环、非单调多边形的单调剖分等处理,可最大限度地减少分区数量,获得若干个单调子区域。针对各单调子区域采用适应性变间距平行路径填充,可减小扫描线的长度,并保证均匀致密性填充。试验表明这种扫描方式能够提高成形效率和成形质量。
文摘基板预热可以显著降低激光金属沉积成形(laser metal deposition shaping,LMDS)过程的热应力,从而抑制成形过程裂缝的产生,但基板预热温度的高低对成形零件的微观组织有着重要的影响,因此研究不同基板预热温度下激光金属沉积成形零件的微观组织变化规律对基板预热温度的选择具有非常重要的意义.利用中国科学院沈阳自动化研究所自行研制的激光金属沉积成形系统和基板预热系统,采用Ni60A金属粉末在基板未预热和预热到200,300,400,500和600℃时分别进行成形试验.然后利用扫描电子显微镜和能量散射谱仪对成形试件的微观组织进行深入的研究,得到不同基板预热温度对激光金属沉积成形零件微观组织的影响规律,为基板预热温度的优化选择提供了重要参考.
