For several decades,chemical mechanical polishing(CMP)has been the most widely used planarization method in integrated circuits manufacturing.The final polishing results are affected by many factors related to the car...For several decades,chemical mechanical polishing(CMP)has been the most widely used planarization method in integrated circuits manufacturing.The final polishing results are affected by many factors related to the carrier structure,the polishing pad,the slurry,and the process parameters.As both chemical and mechanical actions affect the effectiveness of CMP,and these actions are themselves affected by many factors,the CMP mechanism is complex and has been a hot research area for many years.This review provides a basic description of the development,challenges,and key technologies associated with CMP.We summarize theoretical CMP models from the perspectives of kinematics,empirical,its mechanism(from the viewpoint of the atomic scale,particle scale,and wafer scale),and its chemical-mechanical synergy.Experimental approaches to the CMP mechanism of material removal and planarization are further discussed from the viewpoint of the particle wear effect,chemical-mechanical synergy,and wafer-pad interfacial interaction.展开更多
Multi-component mixture(MCM) is a complicated chemical system that contains a great deal of mixture rays with various mixture ratios, and each ray includes many mixtures with different concentration levels.Currently, ...Multi-component mixture(MCM) is a complicated chemical system that contains a great deal of mixture rays with various mixture ratios, and each ray includes many mixtures with different concentration levels.Currently, in combined toxicity field, almost all studies on MCM focus on the mixtures designed by the equivalenteffect concentration ratio(EECR) procedure. However, the EECR mixtures cannot represent the whole mixture system because the EECR mixtures are located on one mixture ray in concentration space formed by multiple components. In our view, some optimal experimental design such as the uniform design(UD) should be used to effectively select many representative mixture rays from the MCM system,instead of single EECR ray. The uniform design ray(UDray) integrating UD idea with fixed-ratio ray design can systematically and comprehensively measure the combined toxicity changes in the MCM system. This review introduces the operation method, construction of uniform table and corresponding usable table, and some cases of application of the UD-ray to help readers easily use UD-ray in their MCM toxicity assessment.展开更多
基金support provided by the Science Fund for Creative Research Groups(Grant No.51021064)the National Natural Science Foundation of China(Grant No.51305227)。
文摘For several decades,chemical mechanical polishing(CMP)has been the most widely used planarization method in integrated circuits manufacturing.The final polishing results are affected by many factors related to the carrier structure,the polishing pad,the slurry,and the process parameters.As both chemical and mechanical actions affect the effectiveness of CMP,and these actions are themselves affected by many factors,the CMP mechanism is complex and has been a hot research area for many years.This review provides a basic description of the development,challenges,and key technologies associated with CMP.We summarize theoretical CMP models from the perspectives of kinematics,empirical,its mechanism(from the viewpoint of the atomic scale,particle scale,and wafer scale),and its chemical-mechanical synergy.Experimental approaches to the CMP mechanism of material removal and planarization are further discussed from the viewpoint of the particle wear effect,chemical-mechanical synergy,and wafer-pad interfacial interaction.
基金supported by the National Natural Science Foundation of China(2117709721207002)Specialized Research Fund for the Doctoral Program of Higher Education(20120072110052)
文摘Multi-component mixture(MCM) is a complicated chemical system that contains a great deal of mixture rays with various mixture ratios, and each ray includes many mixtures with different concentration levels.Currently, in combined toxicity field, almost all studies on MCM focus on the mixtures designed by the equivalenteffect concentration ratio(EECR) procedure. However, the EECR mixtures cannot represent the whole mixture system because the EECR mixtures are located on one mixture ray in concentration space formed by multiple components. In our view, some optimal experimental design such as the uniform design(UD) should be used to effectively select many representative mixture rays from the MCM system,instead of single EECR ray. The uniform design ray(UDray) integrating UD idea with fixed-ratio ray design can systematically and comprehensively measure the combined toxicity changes in the MCM system. This review introduces the operation method, construction of uniform table and corresponding usable table, and some cases of application of the UD-ray to help readers easily use UD-ray in their MCM toxicity assessment.
