根据铋基合金的特点与合金相图,设计了不同成分的Bi Pb Sn Cd易熔合金;并利用差热分析仪、X射线衍射仪及力学检测设备等研究了成分对合金熔点、组织和抗拉强度的影响。结果表明,设计的易熔合金由Bi、Pb7Bi3、Sn和Cd等物相组成;合金的熔...根据铋基合金的特点与合金相图,设计了不同成分的Bi Pb Sn Cd易熔合金;并利用差热分析仪、X射线衍射仪及力学检测设备等研究了成分对合金熔点、组织和抗拉强度的影响。结果表明,设计的易熔合金由Bi、Pb7Bi3、Sn和Cd等物相组成;合金的熔点均在72℃左右。随Cd、Bi元素含量的增加,液相线温度逐渐降低;Cd元素对合金熔程、抗拉强度的影响最大,Sn元素次之,Pb元素的影响最小。正交试验表明,Bi 30Pb 15Sn 9Cd合金的综合性能最佳。展开更多
Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti ac...Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.展开更多
Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ...Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.展开更多
Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the br...Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the brazed joints were analyzed by scanning electron microscopy(SEM) and transmission electron microscope(TEM) in detail, and the compositional distribution along the interface was analyzed by energy-dispersive spectrometer(EDS). Results show that the surface roughness of base metals plays an important role in the quality of the brazed joint because the surface roughness can enlarge the effective contact area, which can improve the brazing surface quality between two materials. A moderate roughness of treated Zr-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range diffusion of atoms occurs between the base metal and solder, and five distinct regions are formed at the joint region.展开更多
Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn...Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.展开更多
基金financial support of this work from the Ministry of Science and Technology, Taibei, China, under Projects No. MOST 105-ET-E-020002-ET, 105-2622-E-020-003-CC3
文摘Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.
基金the National Natural Science Foundation of China(No.52171045).
文摘Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.
基金financially supported by the Natural Science Basic Research Plan in Shaanxi Province of China (No. 2014JM6234)the Specialized Research Fund for Doctoral Program of Higher Education (No. 20136102120007)the Program of Introducing Talents of Discipline to Universities (No. B08040)
文摘Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the brazed joints were analyzed by scanning electron microscopy(SEM) and transmission electron microscope(TEM) in detail, and the compositional distribution along the interface was analyzed by energy-dispersive spectrometer(EDS). Results show that the surface roughness of base metals plays an important role in the quality of the brazed joint because the surface roughness can enlarge the effective contact area, which can improve the brazing surface quality between two materials. A moderate roughness of treated Zr-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range diffusion of atoms occurs between the base metal and solder, and five distinct regions are formed at the joint region.
基金Project(51435004)supported by the National Natural Science Foundation of China
文摘Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.
