Ultrafast laser processing technology has offered a wide range of opportunities in micro/nano fabrication and other fields such as nanotechnology,biotechnology,energy science,and photonics due to its controllable proc...Ultrafast laser processing technology has offered a wide range of opportunities in micro/nano fabrication and other fields such as nanotechnology,biotechnology,energy science,and photonics due to its controllable processing precision,diverse processing capabilities,and broad material adaptability.The processing abilities and applications of the ultrafast laser still need more exploration.In the field of material processing,controlling the atomic scale structure in nanomaterials is challenging.Complex effects exist in ultrafast laser surface/interface processing,making it difficult to modulate the nanostructure and properties of the surface/interface as required.In the ultrafast laser fabrication of micro functional devices,the processing ability needs to be improved.Here,we review the research progress of ultrafast laser micro/nano fabrication in the areas of material processing,surface/interface controlling,and micro functional devices fabrication.Several useful ultrafast laser processing methods and applications in these areas are introduced.With various processing effects and abilities,the ultrafast laser processing technology has demonstrated application values in multiple fields from science to industry.展开更多
Silkworm silk fiber is an attractive material owing to its remarkable mechanical characteristics,excellent optical properties,and good biocompatibility and biodegradability.However,nano-processing of the silk fiber is...Silkworm silk fiber is an attractive material owing to its remarkable mechanical characteristics,excellent optical properties,and good biocompatibility and biodegradability.However,nano-processing of the silk fiber is still a challenge limiting its applications in nanoengineering and related fields.Herein,we report localized near-field enhancement-assisted ablation with an ultrafast laser to break this bottleneck.Localized processing of silk fiber,including nano-holing,nano-grooving,and cutting could retain the key molecular structure building blocks and the pristine functionality of the silk fiber.An extremely narrow nanohole with a width of^64 nm was successfully achieved.The processed silk fiber can be used to transfer micro/nanoparticles and drugs,showing potential for biomedical engineering.The processing strategy developed in this study can also be extended to other materials,paving a new way for fabricating functional nanostructures with precisely controlled size and morphology.展开更多
We describe how a direct combination of an axicon and a lens can represent a simple and efficient beam-shaping solution for laser material processing applications.We produce high-angle pseudo-Bessel micro-beams at 155...We describe how a direct combination of an axicon and a lens can represent a simple and efficient beam-shaping solution for laser material processing applications.We produce high-angle pseudo-Bessel micro-beams at 1550 nm,which would be difficult to produce by other methods.Combined with appropriate stretching of femtosecond pulses,we access optimized conditions inside semiconductors allowing us to develop high-aspect-ratio refractive-index writing methods.Using ultrafast microscopy techniques,we characterize the delivered local intensities and the triggered ionization dynamics inside silicon with 200-fs and 50-ps pulses.While similar plasma densities are produced in both cases,we show that repeated picosecond irradiation induces permanent modifications spontaneously growing shot-after-shot in the direction of the laser beam from front-surface damage to the back side of irradiated silicon wafers.The conditions for direct microexplosion and microchannel drilling similar to those today demonstrated for dielectrics still remain inaccessible.Nonetheless,this work evidences higher energy densities than those previously achieved in semiconductors and a novel percussion writing modality to create structures in silicon with aspect ratios exceeding~700 without any motion of the beam.The estimated transient change of conductivity and measured ionization fronts at near luminal speed along the observed microplasma channels support the vision of vertical electrical connections optically controllable at GHz repetition rates.The permanent silicon modifications obtained by percussion writing are light-guiding structures according to a measured positive refractive index change exceeding 10-2.These findings open the door to unique monolithic solutions for electrical and optical through-silicon-vias which are key elements for vertical interconnections in 3D chip stacks.展开更多
基金supported by the National Natural Science Foundation of China(No.52075289)the Tsinghua-Jiangyin Innovation Special Fund(TJISF,No.2023JYTH0104).
文摘Ultrafast laser processing technology has offered a wide range of opportunities in micro/nano fabrication and other fields such as nanotechnology,biotechnology,energy science,and photonics due to its controllable processing precision,diverse processing capabilities,and broad material adaptability.The processing abilities and applications of the ultrafast laser still need more exploration.In the field of material processing,controlling the atomic scale structure in nanomaterials is challenging.Complex effects exist in ultrafast laser surface/interface processing,making it difficult to modulate the nanostructure and properties of the surface/interface as required.In the ultrafast laser fabrication of micro functional devices,the processing ability needs to be improved.Here,we review the research progress of ultrafast laser micro/nano fabrication in the areas of material processing,surface/interface controlling,and micro functional devices fabrication.Several useful ultrafast laser processing methods and applications in these areas are introduced.With various processing effects and abilities,the ultrafast laser processing technology has demonstrated application values in multiple fields from science to industry.
基金the support from the National Key R&D Program of China(2017YFB1104300,2016YFA0200103 and 2018YFB1107200)the National Program for the Support of Top-notch Young Professionalsthe National Natural Science Foundation of China(51775303)。
文摘Silkworm silk fiber is an attractive material owing to its remarkable mechanical characteristics,excellent optical properties,and good biocompatibility and biodegradability.However,nano-processing of the silk fiber is still a challenge limiting its applications in nanoengineering and related fields.Herein,we report localized near-field enhancement-assisted ablation with an ultrafast laser to break this bottleneck.Localized processing of silk fiber,including nano-holing,nano-grooving,and cutting could retain the key molecular structure building blocks and the pristine functionality of the silk fiber.An extremely narrow nanohole with a width of^64 nm was successfully achieved.The processed silk fiber can be used to transfer micro/nanoparticles and drugs,showing potential for biomedical engineering.The processing strategy developed in this study can also be extended to other materials,paving a new way for fabricating functional nanostructures with precisely controlled size and morphology.
基金conducted using LaMP facilities at LP3.The project received funding from the French National Research Agency(ANR-22-CE92-0057-0,KiSS project)and the European Union’s Horizon 2020 research and innovation program under grant agreements No.101034324(MSCA-COFUND)and No.724480(ERC).
文摘We describe how a direct combination of an axicon and a lens can represent a simple and efficient beam-shaping solution for laser material processing applications.We produce high-angle pseudo-Bessel micro-beams at 1550 nm,which would be difficult to produce by other methods.Combined with appropriate stretching of femtosecond pulses,we access optimized conditions inside semiconductors allowing us to develop high-aspect-ratio refractive-index writing methods.Using ultrafast microscopy techniques,we characterize the delivered local intensities and the triggered ionization dynamics inside silicon with 200-fs and 50-ps pulses.While similar plasma densities are produced in both cases,we show that repeated picosecond irradiation induces permanent modifications spontaneously growing shot-after-shot in the direction of the laser beam from front-surface damage to the back side of irradiated silicon wafers.The conditions for direct microexplosion and microchannel drilling similar to those today demonstrated for dielectrics still remain inaccessible.Nonetheless,this work evidences higher energy densities than those previously achieved in semiconductors and a novel percussion writing modality to create structures in silicon with aspect ratios exceeding~700 without any motion of the beam.The estimated transient change of conductivity and measured ionization fronts at near luminal speed along the observed microplasma channels support the vision of vertical electrical connections optically controllable at GHz repetition rates.The permanent silicon modifications obtained by percussion writing are light-guiding structures according to a measured positive refractive index change exceeding 10-2.These findings open the door to unique monolithic solutions for electrical and optical through-silicon-vias which are key elements for vertical interconnections in 3D chip stacks.
