Partially-depleted Silicon-On-Insulator Negative Channel Metal Oxide Semiconductor （SOI NMOS） transistors with different layouts are fabricated on radiation hard Separation by IMplanted OXygen （SIMOX） substrate an...Partially-depleted Silicon-On-Insulator Negative Channel Metal Oxide Semiconductor （SOI NMOS） transistors with different layouts are fabricated on radiation hard Separation by IMplanted OXygen （SIMOX） substrate and tested using 10 keV X-ray radiation sources. The radiation performance is characterized by transistor threshold voltage shift and transistor leakage currents as a function of the total dose up to 2.0×10^6 rad（Si）. The results show that the total dose radiation effects on NMOS devices are very sensitive to their layout structures.展开更多
RS485通信协议要求:RS485驱动器输出短路至-7~12 V时,短路电流应小于250 m A。常规短路保护电路采用高压MOS实现,由于高压MOS栅极氧化层厚度很大,无法满足抗总剂量辐射加固的要求。提出了一种新型的驱动器输出短路保护电路,该电路利用5 ...RS485通信协议要求:RS485驱动器输出短路至-7~12 V时,短路电流应小于250 m A。常规短路保护电路采用高压MOS实现,由于高压MOS栅极氧化层厚度很大,无法满足抗总剂量辐射加固的要求。提出了一种新型的驱动器输出短路保护电路,该电路利用5 V低压MOS管实现,通过合理设计线路、版图,实现了良好的短路保护效果和抗总剂量辐射能力。电路采用0.8μm SOI CMOS工艺设计实现,常规及辐照测试结果证明了设计的正确性。展开更多
文摘Partially-depleted Silicon-On-Insulator Negative Channel Metal Oxide Semiconductor （SOI NMOS） transistors with different layouts are fabricated on radiation hard Separation by IMplanted OXygen （SIMOX） substrate and tested using 10 keV X-ray radiation sources. The radiation performance is characterized by transistor threshold voltage shift and transistor leakage currents as a function of the total dose up to 2.0×10^6 rad（Si）. The results show that the total dose radiation effects on NMOS devices are very sensitive to their layout structures.
文摘RS485通信协议要求:RS485驱动器输出短路至-7~12 V时,短路电流应小于250 m A。常规短路保护电路采用高压MOS实现,由于高压MOS栅极氧化层厚度很大,无法满足抗总剂量辐射加固的要求。提出了一种新型的驱动器输出短路保护电路,该电路利用5 V低压MOS管实现,通过合理设计线路、版图,实现了良好的短路保护效果和抗总剂量辐射能力。电路采用0.8μm SOI CMOS工艺设计实现,常规及辐照测试结果证明了设计的正确性。
