研究了 2 0钢管 TL P连接接头的组织和性能 ,中间层合金选用 BNi2和 Fe Ni Si B非晶箔 ,在氩气保护下焊接。研究表明 ,室温下接头的拉伸强度和弯曲强度等于或超过基体 ,没有形成脆性相。用 Fe Ni Si B连接的接头 ,比用 BNi2连接的接头...研究了 2 0钢管 TL P连接接头的组织和性能 ,中间层合金选用 BNi2和 Fe Ni Si B非晶箔 ,在氩气保护下焊接。研究表明 ,室温下接头的拉伸强度和弯曲强度等于或超过基体 ,没有形成脆性相。用 Fe Ni Si B连接的接头 ,比用 BNi2连接的接头组织和成分更接近基体。展开更多
Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a mo...Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a moving liquid /solid interface model was used for the parts. Diffusion equations were solved for each half of the joints simultaneously up to the end of isothermal solidification. The completion time of isothermal solidification, concentration profiles and position of the solid/liquid interface for each half were calculated. The intersection of the solid/liquid interfaces of two halves was considered the end of isothermal solidification. To obtain some required diffusion data, TLP bonding of FSX-414/MBF80/IN738 was performed at different temperature and time under vacuum atmosphere. The calculated results show good agreement with the experimental results.展开更多
The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-2...The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-24 h in vacuum. The [001] orientation of each test specimen was aligned perpendicular to the joint interface. The bonded region was observed by optical microscopy, and the microstructural and compositional analyses across the bonded interlayer were performed by using a scanning electron microscopy (SEM). The electron back scattering diffraction (EBSD) method was applied to determine the crystallographic orientation. The results indicated that the chemical homogeneity across the bonded region can be achieved, and γ' phase both in the bonded interlayer and in the superalloy substrate is almost identical, while the bonded interlayer had almost matched the crystallographic orientation of the bonded substrates.展开更多
文摘Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a moving liquid /solid interface model was used for the parts. Diffusion equations were solved for each half of the joints simultaneously up to the end of isothermal solidification. The completion time of isothermal solidification, concentration profiles and position of the solid/liquid interface for each half were calculated. The intersection of the solid/liquid interfaces of two halves was considered the end of isothermal solidification. To obtain some required diffusion data, TLP bonding of FSX-414/MBF80/IN738 was performed at different temperature and time under vacuum atmosphere. The calculated results show good agreement with the experimental results.
文摘The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-24 h in vacuum. The [001] orientation of each test specimen was aligned perpendicular to the joint interface. The bonded region was observed by optical microscopy, and the microstructural and compositional analyses across the bonded interlayer were performed by using a scanning electron microscopy (SEM). The electron back scattering diffraction (EBSD) method was applied to determine the crystallographic orientation. The results indicated that the chemical homogeneity across the bonded region can be achieved, and γ' phase both in the bonded interlayer and in the superalloy substrate is almost identical, while the bonded interlayer had almost matched the crystallographic orientation of the bonded substrates.
