利用硅烷偶联剂KH-570(γ-甲基丙烯酰氧基甲氧基硅烷)水解缩合生成的多面低聚倍半硅氧烷(POSS)溶胶为模板剂,经热解制备低介电多孔薄膜材料.使用FTIR对材料制备过程及形成机制进行动态研究,通过29S i NMR、椭偏仪、氮气吸脱附曲线和TEM...利用硅烷偶联剂KH-570(γ-甲基丙烯酰氧基甲氧基硅烷)水解缩合生成的多面低聚倍半硅氧烷(POSS)溶胶为模板剂,经热解制备低介电多孔薄膜材料.使用FTIR对材料制备过程及形成机制进行动态研究,通过29S i NMR、椭偏仪、氮气吸脱附曲线和TEM等对材料的介电性质、孔洞大小和分布情况进行表征.制备的介电多孔薄膜材料孔洞分布均匀、孔径约1 nm,比表面积为384.1 m2/g,介电常数为2.5的低.展开更多
Modified castor oil-based epoxy resin （EP）/polyurethane （PU） grafted copolymer by glycidyl polyhedral oligomeric silsesquioxane （glycidyl POSS） was synthesized. The damping properties, thermal stability, mechani...Modified castor oil-based epoxy resin （EP）/polyurethane （PU） grafted copolymer by glycidyl polyhedral oligomeric silsesquioxane （glycidyl POSS） was synthesized. The damping properties, thermal stability, mechanical properties and morphology of the grafted copolymer modified by glycidyl POSS were studied systematically. The results revealed that the incorporation of glycidyl POSS improved the damping performance evidently and broadened damping temperature range, especially when the glycidyl POSS content was 0.2%-1%. At the same time, there was a slight increase in thermal stability with the increase of POSS content. The tensile properties changed with the change of the copolymer＇s Tg, decreased at low POSS contents and increased at high POSS contents. This modified copolymer has the potential to be used as film damping material or constrained damping layer.展开更多
文摘利用硅烷偶联剂KH-570(γ-甲基丙烯酰氧基甲氧基硅烷)水解缩合生成的多面低聚倍半硅氧烷(POSS)溶胶为模板剂,经热解制备低介电多孔薄膜材料.使用FTIR对材料制备过程及形成机制进行动态研究,通过29S i NMR、椭偏仪、氮气吸脱附曲线和TEM等对材料的介电性质、孔洞大小和分布情况进行表征.制备的介电多孔薄膜材料孔洞分布均匀、孔径约1 nm,比表面积为384.1 m2/g,介电常数为2.5的低.
基金the National Natural Science Foundation of China for financial support (Nos. 51573102, 51421061, and 51210005)
文摘Modified castor oil-based epoxy resin （EP）/polyurethane （PU） grafted copolymer by glycidyl polyhedral oligomeric silsesquioxane （glycidyl POSS） was synthesized. The damping properties, thermal stability, mechanical properties and morphology of the grafted copolymer modified by glycidyl POSS were studied systematically. The results revealed that the incorporation of glycidyl POSS improved the damping performance evidently and broadened damping temperature range, especially when the glycidyl POSS content was 0.2%-1%. At the same time, there was a slight increase in thermal stability with the increase of POSS content. The tensile properties changed with the change of the copolymer＇s Tg, decreased at low POSS contents and increased at high POSS contents. This modified copolymer has the potential to be used as film damping material or constrained damping layer.
