A fully integrated high linearity differential power amplifier driver with an on-chip transformer in a standard 0.13-μm CMOS process for W-CDMA application is presented.The transformer not only accomplishes output im...A fully integrated high linearity differential power amplifier driver with an on-chip transformer in a standard 0.13-μm CMOS process for W-CDMA application is presented.The transformer not only accomplishes output impedance matching,but also acts as a balun for converting differential signals to single-ended ones.Under a supply voltage of 3.3 V,the measured maximum power is larger than 17 dBm with a peak power efficiency of 21%.The output power at the 1-dB compression point and the power gain are 12.7 dBm and 13.2 dB,respectively. The die size is 0.91×1.12 mm;.展开更多
A 2.4 GHz, direct-conversion RF transmitter front-end with an up converter and PA driver is fabricated in a 0.13/zm CMOS process for the reliable transmission of 54 Mb/s OFDM signals. The front-end output power is -3 ...A 2.4 GHz, direct-conversion RF transmitter front-end with an up converter and PA driver is fabricated in a 0.13/zm CMOS process for the reliable transmission of 54 Mb/s OFDM signals. The front-end output power is -3 dBm while the corresponding EVM is -27 dB which is necessary for the 802.11g standard of EVM at-25 dB. With the adopted gain control strategy the output power changes from -14.3 to -3.7 dBm with every step 0.8 dB （20%） which covers the gain variation due to working temperature and process. A power detector indicates the output power and delivers a voltage to the baseband to control the output power.展开更多
A fully integrated CMOS differential power amplifier driver（PAD） is proposed for WiMAX applications. In order to fulfill the differential application requirements,a transmission line transformer is used as the outpu...A fully integrated CMOS differential power amplifier driver（PAD） is proposed for WiMAX applications. In order to fulfill the differential application requirements,a transmission line transformer is used as the output matching network.A differential inductance constitutes an inter-stage matching network.Meanwhile,an on chip balun realizes input matching as well as single-end to differential conversion.The PAD is fabricated in a 0.13μm RFCMOS process.The chip size is 1.1×1.1 mm^2 with all of the matching network integrated on chip. The saturated power is around 10 dBm and power gain is about 12 dB.展开更多
基金Project supported by the National High Technology Research and Development Program of China(No.2009AA011605)
文摘A fully integrated high linearity differential power amplifier driver with an on-chip transformer in a standard 0.13-μm CMOS process for W-CDMA application is presented.The transformer not only accomplishes output impedance matching,but also acts as a balun for converting differential signals to single-ended ones.Under a supply voltage of 3.3 V,the measured maximum power is larger than 17 dBm with a peak power efficiency of 21%.The output power at the 1-dB compression point and the power gain are 12.7 dBm and 13.2 dB,respectively. The die size is 0.91×1.12 mm;.
文摘A 2.4 GHz, direct-conversion RF transmitter front-end with an up converter and PA driver is fabricated in a 0.13/zm CMOS process for the reliable transmission of 54 Mb/s OFDM signals. The front-end output power is -3 dBm while the corresponding EVM is -27 dB which is necessary for the 802.11g standard of EVM at-25 dB. With the adopted gain control strategy the output power changes from -14.3 to -3.7 dBm with every step 0.8 dB （20%） which covers the gain variation due to working temperature and process. A power detector indicates the output power and delivers a voltage to the baseband to control the output power.
基金Project supported by the National Natural Science Foundation of China(No.61106025)the National High Technology Research and Develop Program of China(No.2012AA012301)
文摘A fully integrated CMOS differential power amplifier driver（PAD） is proposed for WiMAX applications. In order to fulfill the differential application requirements,a transmission line transformer is used as the output matching network.A differential inductance constitutes an inter-stage matching network.Meanwhile,an on chip balun realizes input matching as well as single-end to differential conversion.The PAD is fabricated in a 0.13μm RFCMOS process.The chip size is 1.1×1.1 mm^2 with all of the matching network integrated on chip. The saturated power is around 10 dBm and power gain is about 12 dB.
