In this paper,the MCI（multipath crossover interconnection）technique for octagon single and symmetrical spiral inductors has been presented to improve the quality factor.The metal wires of the single and symmetrical ...In this paper,the MCI（multipath crossover interconnection）technique for octagon single and symmetrical spiral inductors has been presented to improve the quality factor.The metal wires of the single and symmetrical inductors formed by the top metal are divided into multiple segments according to the depth of the skin effects.The outermost path of the metal is crossover-interconnected to the innermost path by the underlayer metal and via The crossover technique makes the lengths of the total current paths between two ports approximately equal to each other.Therefore,the induced magnetic flux and resistance of each path can be balanced and the Q-factor of spiral inductors can be enhanced.The proposed MCI technique has been validated by the electromagnetic simulation with the 130-nm 1P6M SiGe BiCMOS process.For the devices with occupying areas of 240 240 μm^2,results of electromagnetic simulation show that about 24%improvement in the Q-peak（3.3 GHz）of the MCI single inductor as compared to conventional single inductors（3.1 GHz）,and about 88.1%improvement in the Q-peak（3.2 GHz）of the MCI symmetrical inductor as compared to conventional symmetrical inductors（1.8 GHz）.展开更多
Current diffusion is an old issue, nevertheless, the relationship between the current diffusion and the efficiency of light emitting diodes(LEDs) needs to be further quantitatively clarified. By incorporating current ...Current diffusion is an old issue, nevertheless, the relationship between the current diffusion and the efficiency of light emitting diodes(LEDs) needs to be further quantitatively clarified. By incorporating current crowding effect(CCE) into the conventional ABC model, we have theoretically and directly correlated the current diffusion and the internal quantum efficiency(IQE), light extraction efficiency(LEE), and external quantum efficiency(EQE) droop of the lateral LEDs.However, questions still exist for the vertical LEDs(V-LEDs). Here firstly the current diffusion length L_s(I) and L_s(II) have been clarified. Based on this, the influence of CCE on the EQE, IQE, and LEE of V-LEDs were investigated. Specifically to our V-LEDs with moderate series resistivity, L_s(III) was developed by combining L_s(I) and L_s(II), and the CCE effect on the performance of V-LEDs was investigated. The wall-plug efficiency(WPE) of V-LEDs ware investigated finally. Our works provide a deep understanding of the current diffusion status and the correlated efficiency droop in V-LEDs, thus would benefit the V-LEDs' chip design and further efficiency improvement.展开更多
Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness...Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.展开更多
Electromagnetic V-shape bending of small size sheet blank is investigated numerically and experimentally. Three-dimensional electromagnetic field models are established to calculate the magnetic force distribution on ...Electromagnetic V-shape bending of small size sheet blank is investigated numerically and experimentally. Three-dimensional electromagnetic field models are established to calculate the magnetic force distribution on the sheet by software ANSYS / EMAG. Series of electromagnetic V-shape bending forming experiments are presented,in which small size uniform pressure coil and big size round flat spiral coil are used. The results show that small size uniform pressure coil is not suitable for electromagnetic forming of small size flat sheet,and the coil is susceptible to failure such as bulging,ablation and cracking. When the plane dimension of round flat spiral coil is bigger than sheet blank sizes,the induced current crowding effect will be resulted which seriously influence the magnetic force distribution on the sheet. In this case,magnetic force distribution can be adjusted through the change of the relative position between coil and sheet,the desired deformation can be obtained finally. Therefore,big size round flat spiral coil can be well applied to electromagnetic V-shape bending forming of small size flat sheet.展开更多
基金supported in part by the National Natural Science Foundation of China(No.61401101)the Anhui Provincial Natural Science Foundation(Nos.1408085QF122,1608085QF159)+1 种基金the Open Research Program of State Key Laboratory of Millimeter Waves,Southeast University(No.K201401)the Anhui Provincial Outstanding Top-notch Talent Cultivation Project(No.gxfxZD2016164)
文摘In this paper,the MCI（multipath crossover interconnection）technique for octagon single and symmetrical spiral inductors has been presented to improve the quality factor.The metal wires of the single and symmetrical inductors formed by the top metal are divided into multiple segments according to the depth of the skin effects.The outermost path of the metal is crossover-interconnected to the innermost path by the underlayer metal and via The crossover technique makes the lengths of the total current paths between two ports approximately equal to each other.Therefore,the induced magnetic flux and resistance of each path can be balanced and the Q-factor of spiral inductors can be enhanced.The proposed MCI technique has been validated by the electromagnetic simulation with the 130-nm 1P6M SiGe BiCMOS process.For the devices with occupying areas of 240 240 μm^2,results of electromagnetic simulation show that about 24%improvement in the Q-peak（3.3 GHz）of the MCI single inductor as compared to conventional single inductors（3.1 GHz）,and about 88.1%improvement in the Q-peak（3.2 GHz）of the MCI symmetrical inductor as compared to conventional symmetrical inductors（1.8 GHz）.
基金Project supported by the National Key Research and Development Program of China(Grant No.2018YFB0406702)the Professorship Start-up Funding(Grant No.217056)+2 种基金the Innovation-Driven Project of Central South University,China(Grant No.2018CX001)the Project of State Key Laboratory of High-Performance Complex Manufacturing,Central South University,China(Grant No.ZZYJKT2018-01)Guangzhou Science&Technology Project of Guangdong Province,China(Grant Nos.201704030106 and 2016201604030035)
文摘Current diffusion is an old issue, nevertheless, the relationship between the current diffusion and the efficiency of light emitting diodes(LEDs) needs to be further quantitatively clarified. By incorporating current crowding effect(CCE) into the conventional ABC model, we have theoretically and directly correlated the current diffusion and the internal quantum efficiency(IQE), light extraction efficiency(LEE), and external quantum efficiency(EQE) droop of the lateral LEDs.However, questions still exist for the vertical LEDs(V-LEDs). Here firstly the current diffusion length L_s(I) and L_s(II) have been clarified. Based on this, the influence of CCE on the EQE, IQE, and LEE of V-LEDs were investigated. Specifically to our V-LEDs with moderate series resistivity, L_s(III) was developed by combining L_s(I) and L_s(II), and the CCE effect on the performance of V-LEDs was investigated. The wall-plug efficiency(WPE) of V-LEDs ware investigated finally. Our works provide a deep understanding of the current diffusion status and the correlated efficiency droop in V-LEDs, thus would benefit the V-LEDs' chip design and further efficiency improvement.
文摘Three-dimensional thermo-electrical finite element analyses were conducted to simulate the current density and temperature distributions in solder bump joints with different pad geometries.The effects of pad thickness,diameter and shape on current density and temperate distributions were investigated respectively.It was found that pads with larger thickness or/and diameter could reduce current density and temperature in solder bump significantly.Pad shapes affected the current density and temperature distributions in solder bumps.The relatively low current density and temperature didn＇t occur in the bump joint with traditional rounded pad but occurred in bump joints with octagonal and nonagonal pads respectively.Therefore,optimized pad geometry may be designed to alleviate the current crowding effect and reduce the bump temperature,and therefore delay electromigration failure and increase the mean-time-to-failure.
基金Sponsored by the National Basic Research Program of China(Grant No.2011CB012800 and 2011CB012804)
文摘Electromagnetic V-shape bending of small size sheet blank is investigated numerically and experimentally. Three-dimensional electromagnetic field models are established to calculate the magnetic force distribution on the sheet by software ANSYS / EMAG. Series of electromagnetic V-shape bending forming experiments are presented,in which small size uniform pressure coil and big size round flat spiral coil are used. The results show that small size uniform pressure coil is not suitable for electromagnetic forming of small size flat sheet,and the coil is susceptible to failure such as bulging,ablation and cracking. When the plane dimension of round flat spiral coil is bigger than sheet blank sizes,the induced current crowding effect will be resulted which seriously influence the magnetic force distribution on the sheet. In this case,magnetic force distribution can be adjusted through the change of the relative position between coil and sheet,the desired deformation can be obtained finally. Therefore,big size round flat spiral coil can be well applied to electromagnetic V-shape bending forming of small size flat sheet.
