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基于三维蒙特卡洛方法的搅拌摩擦焊晶粒生长模拟 被引量:4
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作者 张昭 胡超平 吴奇 《塑性工程学报》 CAS CSCD 北大核心 2017年第3期231-236,共6页
采用三维湍流模型进行搅拌摩擦焊接过程的数值模拟,结合三维蒙特卡洛模型模拟焊接区域的晶粒生长,通过与文献实验数据的比较验证了模型的有效性。通过流体模型中物质点运动和温度历程结合晶粒生长模型,模拟了焊接搅拌区晶粒结构演变,研... 采用三维湍流模型进行搅拌摩擦焊接过程的数值模拟,结合三维蒙特卡洛模型模拟焊接区域的晶粒生长,通过与文献实验数据的比较验证了模型的有效性。通过流体模型中物质点运动和温度历程结合晶粒生长模型,模拟了焊接搅拌区晶粒结构演变,研究发现搅拌区搅拌头前进侧晶粒尺寸大于返回侧尺寸,结果与文献中晶粒分布相符。模型展示了实验切面中难以观测到的晶粒三维特征,对于定量了解焊接搅拌区三维空间晶粒组织形貌特征以及晶粒尺寸分布有促进作用。 展开更多
关键词 搅拌摩擦焊 湍流模型 三维蒙特卡洛模拟 晶粒分布
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Influence of gate-source/drain misalignment on the performance of bulk FinFETs by a 3D full band Monte Carlo simulation
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作者 王骏成 杜刚 +3 位作者 魏康亮 曾琅 张兴 刘晓彦 《Journal of Semiconductors》 EI CAS CSCD 2013年第4期42-45,共4页
We investigate the influence of gate-source/drain (G-S/D) misalignment on the performance of bulk fin field effect transistors (FinFETs) through the three-dimensional (3D) full band Monte Carlo simulator. Severa... We investigate the influence of gate-source/drain (G-S/D) misalignment on the performance of bulk fin field effect transistors (FinFETs) through the three-dimensional (3D) full band Monte Carlo simulator. Several scat- tering mechanisms, such as acoustic and optical phonon scattering, ionized impurity scattering, impact ionization scattering and surface roughness scattering are considered in our simulator. The influence of G-S/D overlap and underlap on the on-states performance and carrier transport of bulk FinFETs are mainly discussed in our work. Our results show that the on-states currents increase with the increment of G-D/S overlap length and the positions of a potential barrier and average electron energy maximum vary with the G-D/S overlap length. The carrier transport phenomena in bulk FinFETs are due to the effect of scattering and the electric field in the overlap/underlap regime. 展开更多
关键词 bulk FinFET gate-source/drain misalignment 3D monte carlo simulation carrier transport
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Three-dimensional Monte Carlo simulation of bulk fin field effect transistor
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作者 王骏成 杜刚 +2 位作者 魏康亮 张兴 刘晓彦 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第11期421-426,共6页
In this paper, we investigate the performance of the bulk fin field effect transistor (FinFET) through a three- dimensional (3D) full band Monte Carlo simulator with quantum correction. Several scattering mechanis... In this paper, we investigate the performance of the bulk fin field effect transistor (FinFET) through a three- dimensional (3D) full band Monte Carlo simulator with quantum correction. Several scattering mechanisms, such as the acoustic and optical phonon scattering, the ionized impurity scattering, the impact ionization scattering and the surface roughness scattering are considered in our simulator. The effects of the substrate bias and the surface roughness scattering near the Si/SiO2 interface on the performance of bulk FinFET are mainly discussed in our work. Our results show that the on-current of bulk FinFET is sensitive to the surface roughness and that we can reduce the substrate leakage current by modulating the substrate bias voltage. 展开更多
关键词 bulk fin field effect transistor (FinFET) three-dimensional 3D) monte carlo simulation surface roughness scattering substrate bias effect
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