The influence of temperature on the inverse Hall-Petch effect in nanocrystalline （NC） materials is investigated using phase field crystal simulation method. Simulated results indicate that the inverse Hall-Petch eff...The influence of temperature on the inverse Hall-Petch effect in nanocrystalline （NC） materials is investigated using phase field crystal simulation method. Simulated results indicate that the inverse Hall-Petch effect in NC materials becomes weakened at low temperature. The results also show that the change in microscopic deformation mechanism with temperature variation is the main reason for the weakening of the inverse Hall-Petch effect. At elevated temperature, grain rotation and grain boundary （GB） migration seriously reduce the yield stress so that the NC materials exhibit the inverse Hall-Petch effect. However, at low temperature, both grain rotation and GB migration occur with great difficulty, instead, the dislocations nucleated from the cusp of serrated GBs become active. The lack of grain rotation and GB migration during deformation is mainly responsible for the weakening of the inverse Hall-Petch effect. Furthermore, it is found that since small grain size is favorable for GB migration, the degree of weakening decreases with decreasing average grain size at low temperature.展开更多
The natural gabbro samples were deformed at temperature ranging from 700 to 1150 ℃ with strain rate steps of 1 ×10^-4, 2.5 ×10^-5, 6.3 ×10^-6 s^-1. The mechanical data show that sample experiences grad...The natural gabbro samples were deformed at temperature ranging from 700 to 1150 ℃ with strain rate steps of 1 ×10^-4, 2.5 ×10^-5, 6.3 ×10^-6 s^-1. The mechanical data show that sample experiences gradual transition from semi-brittle flow to plastic flow, corresponding to a systematically decreasing stress exponent n with the increasing temperature ranging from 16.5 to 4.1 （He et al. Sci China （D） 46（7）：730-742, 2003）. We investigate microstructures and deformation mechanisms of experimentally deformed gabbro under transmission electron microscope in this study. For low temperature of 700 ℃ to 950℃, the deformation is mainly accommodated with dislocation glide and mechanical twinning, corresponding to stress exponent lager than 5, which means semi-brittle deformation. Whereas with higher temperature up to 1000 ℃-1150 ℃, the deformation is accommodated mainly with dislocation glide and climb corresponding to stress exponent of 4.1, which means plastic deformation. Evidence of dislocation climb has been found as dislocation walls in plagioclase. The observed slip system in plagioclase is （001）1/21110] and that in clinopyroxene are （100）[001] and （010）[001]. The （010）[001] slip system in clinopyroxene is newly found in this work. Melt was found at temperature of 950 ℃-1050 ℃. The melt glass distributed both in melt thin film between two grain boundaries and melt tubules of triangular along three grain boundaries at temperature of 950℃-1000℃. The melt triangular interconnected to the melt film at temperature of 1050 ℃-1150℃, where the melt chemical compositiondifferentiated into iron-rich dark dots and silicate-rich matrix.展开更多
基金financially supported by the National Natural Science Foundation of China(Nos.51174168 and 51274167)Northwestern Polytechnical University Foundation for Fundamental Research(No.NPU-FFR-JC20120222)
文摘The influence of temperature on the inverse Hall-Petch effect in nanocrystalline （NC） materials is investigated using phase field crystal simulation method. Simulated results indicate that the inverse Hall-Petch effect in NC materials becomes weakened at low temperature. The results also show that the change in microscopic deformation mechanism with temperature variation is the main reason for the weakening of the inverse Hall-Petch effect. At elevated temperature, grain rotation and grain boundary （GB） migration seriously reduce the yield stress so that the NC materials exhibit the inverse Hall-Petch effect. However, at low temperature, both grain rotation and GB migration occur with great difficulty, instead, the dislocations nucleated from the cusp of serrated GBs become active. The lack of grain rotation and GB migration during deformation is mainly responsible for the weakening of the inverse Hall-Petch effect. Furthermore, it is found that since small grain size is favorable for GB migration, the degree of weakening decreases with decreasing average grain size at low temperature.
基金sponsored by National Natural Science Foundation of China under grant No.41374184)State key laboratory of Earthquake Dynamics(Grant No.LED2013A05)
文摘The natural gabbro samples were deformed at temperature ranging from 700 to 1150 ℃ with strain rate steps of 1 ×10^-4, 2.5 ×10^-5, 6.3 ×10^-6 s^-1. The mechanical data show that sample experiences gradual transition from semi-brittle flow to plastic flow, corresponding to a systematically decreasing stress exponent n with the increasing temperature ranging from 16.5 to 4.1 （He et al. Sci China （D） 46（7）：730-742, 2003）. We investigate microstructures and deformation mechanisms of experimentally deformed gabbro under transmission electron microscope in this study. For low temperature of 700 ℃ to 950℃, the deformation is mainly accommodated with dislocation glide and mechanical twinning, corresponding to stress exponent lager than 5, which means semi-brittle deformation. Whereas with higher temperature up to 1000 ℃-1150 ℃, the deformation is accommodated mainly with dislocation glide and climb corresponding to stress exponent of 4.1, which means plastic deformation. Evidence of dislocation climb has been found as dislocation walls in plagioclase. The observed slip system in plagioclase is （001）1/21110] and that in clinopyroxene are （100）[001] and （010）[001]. The （010）[001] slip system in clinopyroxene is newly found in this work. Melt was found at temperature of 950 ℃-1050 ℃. The melt glass distributed both in melt thin film between two grain boundaries and melt tubules of triangular along three grain boundaries at temperature of 950℃-1000℃. The melt triangular interconnected to the melt film at temperature of 1050 ℃-1150℃, where the melt chemical compositiondifferentiated into iron-rich dark dots and silicate-rich matrix.
