以铜修饰氰桥配位聚合物复合玻碳电极（Cu CME）为工作电极,利用阴极溶出伏安法检测H2O2。实验结果证明,该复合修饰电极是对H2O2有较好的感应,检测H2O2有较明显的峰形,操作简单快捷。在最佳的实验条件下,H2O2的峰电流值和其浓度在0.5-16...以铜修饰氰桥配位聚合物复合玻碳电极（Cu CME）为工作电极,利用阴极溶出伏安法检测H2O2。实验结果证明,该复合修饰电极是对H2O2有较好的感应,检测H2O2有较明显的峰形,操作简单快捷。在最佳的实验条件下,H2O2的峰电流值和其浓度在0.5-160 m M的范围内呈双对数的线性关系,线性相关系数达到0.9986。此外,该复合修饰电极在灵敏度,重现性和稳定性等方面都有很好的性能。展开更多
Cu modified layer was prepared on the surface of AISI304 stainless steel by plasma surface alloying technique. The effects of processing parameters on the thickness, surface topography, microstructure and chemical com...Cu modified layer was prepared on the surface of AISI304 stainless steel by plasma surface alloying technique. The effects of processing parameters on the thickness, surface topography, microstructure and chemical composition of Cu modified layer were characterized using glow discharge optical emission spectroscopy （GDOES）, scanning electron microscopy （SEM） and X-ray diffraction （XRD）. The experimental results show that the surface modified layer is a duplex layer （deposited ＋ diffused layer） with thickness of about 26 ktm under the optimum process parameters. The modified layer is mainly composed of a mixture of Cu and expanded austenite phase. The ball-on-disk results show that the modified layer possesses low friction coefficients （0.25） and excellent wear resistance （wear volume 0.005 x 109 um3）. The Cu modified layer is very effective in killing the bacteria S. aureus. Meanwhile, no viable S. aureus is found after 3 h （100% killed） by contact with the Cu alloyed surface.展开更多
文摘以铜修饰氰桥配位聚合物复合玻碳电极（Cu CME）为工作电极,利用阴极溶出伏安法检测H2O2。实验结果证明,该复合修饰电极是对H2O2有较好的感应,检测H2O2有较明显的峰形,操作简单快捷。在最佳的实验条件下,H2O2的峰电流值和其浓度在0.5-160 m M的范围内呈双对数的线性关系,线性相关系数达到0.9986。此外,该复合修饰电极在灵敏度,重现性和稳定性等方面都有很好的性能。
基金Funded by the National Natural Science Foundation of China (No.51171125)the Research Project Supported by Shanxi Scholarship council of China (No.2011-038)+1 种基金the Shanxi Province Science and Technology Key Project(No.20110321051)the Undergraduate Innovation Project of Taiyuan(No.100115101)
文摘Cu modified layer was prepared on the surface of AISI304 stainless steel by plasma surface alloying technique. The effects of processing parameters on the thickness, surface topography, microstructure and chemical composition of Cu modified layer were characterized using glow discharge optical emission spectroscopy （GDOES）, scanning electron microscopy （SEM） and X-ray diffraction （XRD）. The experimental results show that the surface modified layer is a duplex layer （deposited ＋ diffused layer） with thickness of about 26 ktm under the optimum process parameters. The modified layer is mainly composed of a mixture of Cu and expanded austenite phase. The ball-on-disk results show that the modified layer possesses low friction coefficients （0.25） and excellent wear resistance （wear volume 0.005 x 109 um3）. The Cu modified layer is very effective in killing the bacteria S. aureus. Meanwhile, no viable S. aureus is found after 3 h （100% killed） by contact with the Cu alloyed surface.
