Flexible copper clad laminates(FCCLs) were fabricated using the electro-plating process and the combined effect of the current density and plating time on their surface morphology,texture,hardness,electrical resistivi...Flexible copper clad laminates(FCCLs) were fabricated using the electro-plating process and the combined effect of the current density and plating time on their surface morphology,texture,hardness,electrical resistivity and folding behavior was evaluated.To achieve Cu layers with similar thicknesses,the current density was varied in the range of 0.2-3 A/dm2 and the plating time was controlled in the range of 0.5-7.5 h to compensate for the variation of the current density.The surface morphology,hardness,and folding behavior were characterized by atomic force microscopy,nanoindentation technique and Massachusett Institute of Technology folding endurance test,respectively.The X-ray diffraction patterns indicated that the Cu phase was formed without any secondary phases;however,the preferred orientation changed from(220) to(111) as the current density increased over 1 A/dm2.In addition,it was observed that the root-mean-square and hardness values decreased when the current density increased and the plating time decreased simultaneously.The electrical resistivity was as low as approximately 21 nΩ·m and the number of cycles without failure in the folding test was over 15 000,which were comparable to those of commercial FCCLs.展开更多
YBa2Cu3O7-x(YBCO) films were fabricated on an LAO substrate using the trifluoroacetic acid-metal organic deposition(TFA-MOD) method and the effects of the humidity and heat treatment temperatures on the microstructure...YBa2Cu3O7-x(YBCO) films were fabricated on an LAO substrate using the trifluoroacetic acid-metal organic deposition(TFA-MOD) method and the effects of the humidity and heat treatment temperatures on the microstructure,degree of texture and critical properties of the films were evaluated.In order to understand the combined effects of the humidity and the calcining and firing temperatures on critical properties,heat-treatment was performed at various temperatures with the other processing variables fixed.The films were calcined at 400-430 ℃ and fired at 750-800 ℃ in a 0-12.1% humidified Ar-O2 atmosphere.The texture was determined by pole-figure analysis.The amount of the BaF2 phase was effectively reduced and a sharp and strong biaxial texture was formed under a humidified atmosphere,which led to increased critical properties.In addition,the microstructure varied significantly with firing temperature but changed little with calcining temperature.The highest IC of 40 A/cm-width,which corresponds to JC value of 1.8 MA/cm2,was obtained for the films fired at 775 ℃(in 12.1% humidity) after calcining at 400-430 ℃.It is likely that the highest IC value is due to the formation of a more pure YBCO phase,c-axis grains,and a denser microstructure.展开更多
基金supported by Grant No.RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce,Industry and Energy (MOCIE),Korea
文摘Flexible copper clad laminates(FCCLs) were fabricated using the electro-plating process and the combined effect of the current density and plating time on their surface morphology,texture,hardness,electrical resistivity and folding behavior was evaluated.To achieve Cu layers with similar thicknesses,the current density was varied in the range of 0.2-3 A/dm2 and the plating time was controlled in the range of 0.5-7.5 h to compensate for the variation of the current density.The surface morphology,hardness,and folding behavior were characterized by atomic force microscopy,nanoindentation technique and Massachusett Institute of Technology folding endurance test,respectively.The X-ray diffraction patterns indicated that the Cu phase was formed without any secondary phases;however,the preferred orientation changed from(220) to(111) as the current density increased over 1 A/dm2.In addition,it was observed that the root-mean-square and hardness values decreased when the current density increased and the plating time decreased simultaneously.The electrical resistivity was as low as approximately 21 nΩ·m and the number of cycles without failure in the folding test was over 15 000,which were comparable to those of commercial FCCLs.
基金supported by Samsung Research Fund,Sungkyunkwan University,2006
文摘YBa2Cu3O7-x(YBCO) films were fabricated on an LAO substrate using the trifluoroacetic acid-metal organic deposition(TFA-MOD) method and the effects of the humidity and heat treatment temperatures on the microstructure,degree of texture and critical properties of the films were evaluated.In order to understand the combined effects of the humidity and the calcining and firing temperatures on critical properties,heat-treatment was performed at various temperatures with the other processing variables fixed.The films were calcined at 400-430 ℃ and fired at 750-800 ℃ in a 0-12.1% humidified Ar-O2 atmosphere.The texture was determined by pole-figure analysis.The amount of the BaF2 phase was effectively reduced and a sharp and strong biaxial texture was formed under a humidified atmosphere,which led to increased critical properties.In addition,the microstructure varied significantly with firing temperature but changed little with calcining temperature.The highest IC of 40 A/cm-width,which corresponds to JC value of 1.8 MA/cm2,was obtained for the films fired at 775 ℃(in 12.1% humidity) after calcining at 400-430 ℃.It is likely that the highest IC value is due to the formation of a more pure YBCO phase,c-axis grains,and a denser microstructure.
