利用蒙特卡罗方法,模拟计算了不同线性能量传输(liner energy transfer,LET)的重离子在碳化硅中的能量损失,模拟结果表明:重离子在碳化硅中单位深度的能量损失受离子能量和入射深度共同影响;能量损失主要由初级重离子和次级电子产生,非...利用蒙特卡罗方法,模拟计算了不同线性能量传输(liner energy transfer,LET)的重离子在碳化硅中的能量损失,模拟结果表明:重离子在碳化硅中单位深度的能量损失受离子能量和入射深度共同影响;能量损失主要由初级重离子和次级电子产生,非电离能量损失只占总能量损失的1%左右;随着LET的增大,次级电子的初始角度和能量分布越来越集中;重离子诱导产生的电荷沉积峰值位置在重离子径迹中心,在垂直于入射深度方向上呈高斯线性减小分布.利用锎源进行碳化硅MOSFET单粒子烧毁试验,结合TCAD模拟得到不同漏极电压下器件内部电场分布,在考虑电场作用的蒙特卡罗模拟中发现:碳化硅MOSFET外延层的电场强度越大,重离子受电场作用在外延层运动的路径越长、沉积能量越多,次级电子越容易偏向电场方向运动导致局部能量沉积过高.展开更多
The energy deposition and electrothermal behavior of SiC metal-oxide-semiconductor field-effect transistor(MOSFET)under heavy ion radiation are investigated based on Monte Carlo method and TCAD numerical simulation.Th...The energy deposition and electrothermal behavior of SiC metal-oxide-semiconductor field-effect transistor(MOSFET)under heavy ion radiation are investigated based on Monte Carlo method and TCAD numerical simulation.The Monte Carlo simulation results show that the density of heavy ion-induced energy deposition is the largest in the center of the heavy ion track.The time for energy deposition in SiC is on the order of picoseconds.The TCAD is used to simulate the single event burnout(SEB)sensitivity of SiC MOSFET at four representative incident positions and four incident depths.When heavy ions strike vertically from SiC MOSFET source electrode,the SiC MOSFET has the shortest SEB time and the lowest SEB voltage with respect to direct strike from the epitaxial layer,strike from the channel,and strike from the body diode region.High current and strong electric field simultaneously appear in the local area of SiC MOSFET,resulting in excessive power dissipation,further leading to excessive high lattice temperature.The gate-source junction area and the substrate-epitaxial layer junction area are both the regions where the SiC lattice temperature first reaches the SEB critical temperature.In the SEB simulation of SiC MOSFET at different incident depths,when the incident depth does not exceed the device's epitaxial layer,the heavy-ion-induced charge deposition is not enough to make lattice temperature reach the SEB critical temperature.展开更多
文摘利用蒙特卡罗方法,模拟计算了不同线性能量传输(liner energy transfer,LET)的重离子在碳化硅中的能量损失,模拟结果表明:重离子在碳化硅中单位深度的能量损失受离子能量和入射深度共同影响;能量损失主要由初级重离子和次级电子产生,非电离能量损失只占总能量损失的1%左右;随着LET的增大,次级电子的初始角度和能量分布越来越集中;重离子诱导产生的电荷沉积峰值位置在重离子径迹中心,在垂直于入射深度方向上呈高斯线性减小分布.利用锎源进行碳化硅MOSFET单粒子烧毁试验,结合TCAD模拟得到不同漏极电压下器件内部电场分布,在考虑电场作用的蒙特卡罗模拟中发现:碳化硅MOSFET外延层的电场强度越大,重离子受电场作用在外延层运动的路径越长、沉积能量越多,次级电子越容易偏向电场方向运动导致局部能量沉积过高.
基金the National Natural Science Foundation of China(Grant Nos.11875229 and 12075065).
文摘The energy deposition and electrothermal behavior of SiC metal-oxide-semiconductor field-effect transistor(MOSFET)under heavy ion radiation are investigated based on Monte Carlo method and TCAD numerical simulation.The Monte Carlo simulation results show that the density of heavy ion-induced energy deposition is the largest in the center of the heavy ion track.The time for energy deposition in SiC is on the order of picoseconds.The TCAD is used to simulate the single event burnout(SEB)sensitivity of SiC MOSFET at four representative incident positions and four incident depths.When heavy ions strike vertically from SiC MOSFET source electrode,the SiC MOSFET has the shortest SEB time and the lowest SEB voltage with respect to direct strike from the epitaxial layer,strike from the channel,and strike from the body diode region.High current and strong electric field simultaneously appear in the local area of SiC MOSFET,resulting in excessive power dissipation,further leading to excessive high lattice temperature.The gate-source junction area and the substrate-epitaxial layer junction area are both the regions where the SiC lattice temperature first reaches the SEB critical temperature.In the SEB simulation of SiC MOSFET at different incident depths,when the incident depth does not exceed the device's epitaxial layer,the heavy-ion-induced charge deposition is not enough to make lattice temperature reach the SEB critical temperature.
