The growth process of GeOx films formed by plasma post-oxidation （PPO） at room temperature （RT） is investigated using angle-resolved x-ray photoelectron spectroscopy （AR-XPS）. The experimental results show that ...The growth process of GeOx films formed by plasma post-oxidation （PPO） at room temperature （RT） is investigated using angle-resolved x-ray photoelectron spectroscopy （AR-XPS）. The experimental results show that the distributions of the Ge4＋ states, a mixture of the Ge^2＋ and Ge^3＋ states, and the Ge^1＋ states are localized from the GeOx surface to the GeOx/Ge interface. Moreover, the Ge^1＋ states are predominant when the two outermost layers of Ge atoms are oxidized. These findings are helpful for establishing in-depth knowledge of the growth mechanism of the GeOx layer and valuable for the optimization of Ge-based gate stacks for future complementary metal-oxide-semiconductor （MOS） field-effect transistor （CMOSFET） devices.展开更多
A high crystalline quality of SiGe fin with an Si-rich composition area using the replacement fin processing is systematically demonstrated in this paper.The fin replacement process based on a standard FinFET process ...A high crystalline quality of SiGe fin with an Si-rich composition area using the replacement fin processing is systematically demonstrated in this paper.The fin replacement process based on a standard FinFET process is developed.A width of less than 20-nm SiGe fin without obvious defect impact both in the direction across the fin and in the direction along the fin is verified by using the high angle annular dark field scanning transmission electron microscopy and the scanning moiréfringe imaging technique.Moreover,the SiGe composition is inhomogenous in the width of the fin.This is induced by the formation of 111 facets.Due to the atomic density of the 111 facets being higher,the epitaxial growth in the direction perpendicular to these facets is slower than in the direction perpendicular to 001.The Ge incorporation is then higher on the 111 facets than on the 001 facets.So,an Si-rich area is observed in the central area and on the bottom of SiGe fin.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.61574168 and 61504163)
文摘The growth process of GeOx films formed by plasma post-oxidation （PPO） at room temperature （RT） is investigated using angle-resolved x-ray photoelectron spectroscopy （AR-XPS）. The experimental results show that the distributions of the Ge4＋ states, a mixture of the Ge^2＋ and Ge^3＋ states, and the Ge^1＋ states are localized from the GeOx surface to the GeOx/Ge interface. Moreover, the Ge^1＋ states are predominant when the two outermost layers of Ge atoms are oxidized. These findings are helpful for establishing in-depth knowledge of the growth mechanism of the GeOx layer and valuable for the optimization of Ge-based gate stacks for future complementary metal-oxide-semiconductor （MOS） field-effect transistor （CMOSFET） devices.
基金the Beijing Municipal Natural Science Foundation,China(Grant No.4202078)the National Key Project of Science and Technology of China(Grant No.2017ZX02315001-002).
文摘A high crystalline quality of SiGe fin with an Si-rich composition area using the replacement fin processing is systematically demonstrated in this paper.The fin replacement process based on a standard FinFET process is developed.A width of less than 20-nm SiGe fin without obvious defect impact both in the direction across the fin and in the direction along the fin is verified by using the high angle annular dark field scanning transmission electron microscopy and the scanning moiréfringe imaging technique.Moreover,the SiGe composition is inhomogenous in the width of the fin.This is induced by the formation of 111 facets.Due to the atomic density of the 111 facets being higher,the epitaxial growth in the direction perpendicular to these facets is slower than in the direction perpendicular to 001.The Ge incorporation is then higher on the 111 facets than on the 001 facets.So,an Si-rich area is observed in the central area and on the bottom of SiGe fin.
