Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etc...Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etched on one side of silicon(Si) substrate,which was then packaged with aluminum heat sink to form an MHP.On the other side of Si substrate,three LED chips were fixed by die bonding.Then experiments were performed to study the thermal performance of this LED device.The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power,the optimum filling ratio changes from 30% to 48%,and the time reaching stable state is reduced; when the input power is equal to 2.5 W,only the LED device with filling ratio of 48% can work normally.So integrating MHP into high-power LED device can implement the effective control of junction temperature.展开更多
Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroformin...Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper(Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0 °C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs.展开更多
基金supported by the State Key Development Program for Basic Research of China(No.2011CB013105)
文摘Micro heat pipe(MHP) is applied to implement the efficient heat transfer of light emitting diode(LED) device.The fabrication of MHP is based on micro-electro-mechanical-system(MEMS) technique,15 micro grooves were etched on one side of silicon(Si) substrate,which was then packaged with aluminum heat sink to form an MHP.On the other side of Si substrate,three LED chips were fixed by die bonding.Then experiments were performed to study the thermal performance of this LED device.The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power,the optimum filling ratio changes from 30% to 48%,and the time reaching stable state is reduced; when the input power is equal to 2.5 W,only the LED device with filling ratio of 48% can work normally.So integrating MHP into high-power LED device can implement the effective control of junction temperature.
基金supported by the State Key Development Program for Basic Research of China(No.2011CB013105)
文摘Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper(Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0 °C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs.
