The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the b...The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.展开更多
The microstructures and properties of A1-45%Si alloy prepared by liquid-solid separation （LSS） process and spray deposition （SD） were studied. The results show that the size, shape and distribution of the primary ...The microstructures and properties of A1-45%Si alloy prepared by liquid-solid separation （LSS） process and spray deposition （SD） were studied. The results show that the size, shape and distribution of the primary Si phase have different influence on the properties of alloys. Comparing with the Si particles with irregular shape, fine size and continuous distribution in SD alloy, the primary Si phase in LSS alloy is sphere-like, coarse and surrounded by the continuous AI matrix. The microstructure features of LSS alloy are beneficial to the higher thermal conductivity and lower thermal expansion coefficient at room temperature. The fine Si particle in SD alloy is advantageous to improving the mechanical properties. The increasing rates of thermal expansion coefficient with temperature are influenced by the distribution of the Si particles, where a lower rate is obtained in SD alloy with continuous Si particles. The agreement of thermal expansion coefficient with the model in LSS alloy differs from that in the SD alloy because of the different microstructure characteristics.展开更多
文摘The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.
文摘The microstructures and properties of A1-45%Si alloy prepared by liquid-solid separation （LSS） process and spray deposition （SD） were studied. The results show that the size, shape and distribution of the primary Si phase have different influence on the properties of alloys. Comparing with the Si particles with irregular shape, fine size and continuous distribution in SD alloy, the primary Si phase in LSS alloy is sphere-like, coarse and surrounded by the continuous AI matrix. The microstructure features of LSS alloy are beneficial to the higher thermal conductivity and lower thermal expansion coefficient at room temperature. The fine Si particle in SD alloy is advantageous to improving the mechanical properties. The increasing rates of thermal expansion coefficient with temperature are influenced by the distribution of the Si particles, where a lower rate is obtained in SD alloy with continuous Si particles. The agreement of thermal expansion coefficient with the model in LSS alloy differs from that in the SD alloy because of the different microstructure characteristics.
