氮化镓(GaN)高电子迁移率晶体管(high electron mobility transistor,HEMT)以其击穿场强高、导通电阻低、转换效率高等特点引起科研人员的广泛关注并有望应用于电力电子系统中,但其高功率密度和高频特性给封装技术带来极大挑战。传统硅...氮化镓(GaN)高电子迁移率晶体管(high electron mobility transistor,HEMT)以其击穿场强高、导通电阻低、转换效率高等特点引起科研人员的广泛关注并有望应用于电力电子系统中,但其高功率密度和高频特性给封装技术带来极大挑战。传统硅基电力电子器件封装中寄生电感参数较大,会引起开关振荡等问题,使GaN的优良性能难以充分发挥;另外,封装的热管理能力决定了功率器件的可靠性,若不能很好地解决器件的自热效应,会导致其性能降低,甚至芯片烧毁。本文在阐释传统封装技术应用于氮化镓功率电子器件时产生的开关震荡和热管理问题基础上,详细综述了针对以上问题进行的GaN封装技术研究进展,包括通过优化控制电路、减小电感L_(g)、提高电阻R_(g)抑制dv/dt、在栅电极上加入铁氧体磁环、优化PCB布局、提高磁通抵消量等方法解决寄生电感导致的开关振荡、高导热材料金刚石在器件热管理中的应用、器件封装结构改进,以及其他散热技术等。展开更多
Gallium Nitride （GaN） room temperature α particle detectors are fabricated and characterized, whose device structure is Schottky diode. The current-voltage （I- V） measurements reveal that the reverse breakdown vo...Gallium Nitride （GaN） room temperature α particle detectors are fabricated and characterized, whose device structure is Schottky diode. The current-voltage （I- V） measurements reveal that the reverse breakdown voltage of the detectors is more than 200 V owing to the consummate fabrication processes, and that the Schottky barrier and ideal factor of the detectors are 0.64 eV and 1.02, respectively, calculated from the thermionic transmission model. ^241Am α particles pulse height spectra from the GaN detectors biased at -8 V is obviously one Gauss peak located at channel 44 with the full width at half maximum （FWHM） of 15.87 in channel. One of the main reasons for the relatively wider FWHM is that the air between the detectors and isotope could widen the spectrum.展开更多
We report an Al0.25Ga0.75N/GaN based lateral field emission device with a nanometer scale void channel. A -45 nm void channel is obtained by etching out the SiO2 sacrificial dielectric layer between the semiconductor ...We report an Al0.25Ga0.75N/GaN based lateral field emission device with a nanometer scale void channel. A -45 nm void channel is obtained by etching out the SiO2 sacrificial dielectric layer between the semiconductor emitter and the metal collector. Under an atmospheric environment instead of vacuum conditions, the OaN- based field emission device shows a low turn-on voltage of 2.3 V, a high emission current of -40 μA （line current density 2.3mA/cm） at a collector bias Vc = 3 V, and a low reverse leakage of 3nA at Vc = -3 V. These characteristics are attributed to the nanometer scale void channel as well as the high density of two-dimensional electron gas in the AlGaN/GaN heterojunction. This type of device may have potential applications in high frequency mieroelectronics or nanoelectronics.展开更多
We report an enhancement-mode InAlN/GaN MISHEMT with a low gate leakage current by a thermal oxidation technique under gate.The off-state source-drain current density is as low as～10^（17） A/mm at V_（GS）= 0 V and...We report an enhancement-mode InAlN/GaN MISHEMT with a low gate leakage current by a thermal oxidation technique under gate.The off-state source-drain current density is as low as～10^（17） A/mm at V_（GS）= 0 V and V_（DS） = 5 V.The threshold voltage is measured to be ＋0.8 V by linear extrapolation from the transfer characteristics.The E-mode device exhibits a peak transconductance of 179 mS/mm at a gate bias of 3.4 V.A low reverse gate leakage current density of 4.9×10^（17） A/mm is measured at V_（GS） =-15 V.展开更多
文摘氮化镓(GaN)高电子迁移率晶体管(high electron mobility transistor,HEMT)以其击穿场强高、导通电阻低、转换效率高等特点引起科研人员的广泛关注并有望应用于电力电子系统中,但其高功率密度和高频特性给封装技术带来极大挑战。传统硅基电力电子器件封装中寄生电感参数较大,会引起开关振荡等问题,使GaN的优良性能难以充分发挥;另外,封装的热管理能力决定了功率器件的可靠性,若不能很好地解决器件的自热效应,会导致其性能降低,甚至芯片烧毁。本文在阐释传统封装技术应用于氮化镓功率电子器件时产生的开关震荡和热管理问题基础上,详细综述了针对以上问题进行的GaN封装技术研究进展,包括通过优化控制电路、减小电感L_(g)、提高电阻R_(g)抑制dv/dt、在栅电极上加入铁氧体磁环、优化PCB布局、提高磁通抵消量等方法解决寄生电感导致的开关振荡、高导热材料金刚石在器件热管理中的应用、器件封装结构改进,以及其他散热技术等。
基金Supported by the National Natural Science Foundation of China under Grant No 10875084, the Natural Science Foundation of Jiangsu Province under Grant No BK2008174, the Applied Science Foundation of Suzhou under Grant No SYJG0915, and the National Basic Research Program of China under Grant No G2009CB929300.
文摘Gallium Nitride （GaN） room temperature α particle detectors are fabricated and characterized, whose device structure is Schottky diode. The current-voltage （I- V） measurements reveal that the reverse breakdown voltage of the detectors is more than 200 V owing to the consummate fabrication processes, and that the Schottky barrier and ideal factor of the detectors are 0.64 eV and 1.02, respectively, calculated from the thermionic transmission model. ^241Am α particles pulse height spectra from the GaN detectors biased at -8 V is obviously one Gauss peak located at channel 44 with the full width at half maximum （FWHM） of 15.87 in channel. One of the main reasons for the relatively wider FWHM is that the air between the detectors and isotope could widen the spectrum.
基金Supported by the Natural Science Foundation of Jiangsu Province under Grant No BK20160400the Science and Technology Project of Suzhou under Grant No SZS201508
文摘We report an Al0.25Ga0.75N/GaN based lateral field emission device with a nanometer scale void channel. A -45 nm void channel is obtained by etching out the SiO2 sacrificial dielectric layer between the semiconductor emitter and the metal collector. Under an atmospheric environment instead of vacuum conditions, the OaN- based field emission device shows a low turn-on voltage of 2.3 V, a high emission current of -40 μA （line current density 2.3mA/cm） at a collector bias Vc = 3 V, and a low reverse leakage of 3nA at Vc = -3 V. These characteristics are attributed to the nanometer scale void channel as well as the high density of two-dimensional electron gas in the AlGaN/GaN heterojunction. This type of device may have potential applications in high frequency mieroelectronics or nanoelectronics.
基金supported by the National Natural Science Foundation of China(Nos.10990102,60890192,60876009)
文摘We report an enhancement-mode InAlN/GaN MISHEMT with a low gate leakage current by a thermal oxidation technique under gate.The off-state source-drain current density is as low as～10^（17） A/mm at V_（GS）= 0 V and V_（DS） = 5 V.The threshold voltage is measured to be ＋0.8 V by linear extrapolation from the transfer characteristics.The E-mode device exhibits a peak transconductance of 179 mS/mm at a gate bias of 3.4 V.A low reverse gate leakage current density of 4.9×10^（17） A/mm is measured at V_（GS） =-15 V.
