摘要
通用闪存存储(UFS)产品具备了高性能、大容量、低能耗、可靠性和兼容性等特点,因此UFS产品内部各层互连要求极高,在生产过程中极易发生断路问题。本文主要深入研究UFS产品的整个结构以及断路异常问题,分析产品内部的承接基板发生裂纹的主要影响因素,并且通过DOE测试改善由基板发生裂纹所导致UFS产品断路的异常,最终基于测试结果为后续UFS产品的生产可靠性和安全性提供方向和建议。
Universal Flash Storage(UFS)products are characterized by high performance,large capacity,low power consumption,reliability,and compatibility.Therefore,the interconnection requirements of each layer inside the UFS products are very high,and open-circuit problems are very likely to occur in the production process.This paper focuses on the in-depth study of the entire structure of UFS and open-circuit anomalies,analyzes the main factors affecting the occurrence of cracks on the substrate inside the products,and improves the anomalies of open-circuit of the products caused by cracks on the substrate through DOE testing,and finally,provides directions and suggestions for the reliability and safety of the subsequent production of UFS products based on the test results.
作者
付永朝
肖俊
邵滋人
王静
徐刚
FU Yong-chao;XIAO Jun;SHAO Zi-ren;WANG Jing;XU Gang(Unimos Microelectronics(Shanghai)Co.,Ltd)
出处
《中国集成电路》
2024年第8期40-45,共6页
China lntegrated Circuit
关键词
通用闪存存储
断路
无芯基板
可靠性
盲孔残胶
除胶
UFS
open circuit
coreless substrate
reliability
blind hole residue
remove glue
