摘要
封装基板作为半导体封装的载体,为芯片提供电连接、保护、支撑和散热。受到电、热、尺寸、功能性以及周期成本的综合驱动,封装基板向着薄厚度、高散热性、精细线路、高集成度、短制造周期方向发展。介绍了先进封装基板的发展趋势和技术方向,重点介绍了FCBGA、无芯封装基板和埋入基板等几种先进封装基板前沿技术的定义、应用及研究现状。
As the carrier of the semiconductor package,packaging substrate provides electrical connection,protection,support and heat dissipation for the chip.Driven by electricity,heat,size,functionality,and cycle cost,packaging substrates are developing in the direction of thin thickness,high heat dissipation,fine lines,high integration,and short manufacturing cycles.This article introduces the technical direction of packaging substrates,focusing on the definition,application and research status of several advanced packaging substrate such as FCBGA substrate,coreless substrate and substrate embedding.
作者
桂萌琦
方志丹
GUI Mengqi;FANG Zhidan(National Center for Advanced Packaging Co.,Ltd.,Wuxi 214000,China;Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China)
出处
《微纳电子与智能制造》
2021年第1期98-103,共6页
Micro/nano Electronics and Intelligent Manufacturing
基金
极低本底光探测器模块关键问题研究(12075269)项目资助。
