摘要
在层压过程中影响印制电路板涨缩核心因素是半固化片的固化收缩与应力释放，文章分析了半固化片的收缩机理，对比研究了不同树脂体系、不同玻布规格、不同RC含量、不同半固化片数量在层压过程涨缩变化规律及影响权重，并且通过建立模型去预测印制电路板涨缩值。研究表明：树脂体系是层压涨缩最重要影响因素，同时，给出了印制电路板涨缩预测模型，并且验证了模型的可行性，可为印制电路板涨缩机理探究及生产过程中印制电路板涨缩补偿系数的确定提供理论、数据支持。
The key factor that affects the PCB shrinkage is the curing shrinkage and stress release of the prepreg in the lamination process. In this paper, the mechanism of shrinkage of PCB was analyzed. The variation of the shrinkage of prepregs with different resin systems, different glass cloth sizes, different RC contents, different number of prepreg sheets and effect weight were discussed, and the model was established to predict the shrinkage of PCB. It shows that the most important factor of the PCB was resin systems. At the same time, the model was given and the feasibility of the model was verified, which provided theoretical and technical support for the research of shrinkage mechanism of PCB and determination of the compensation coefficient of PCB in the production process.
作者
李华
程柳军
何泳仪
李艳国
Li Hua;Cheng Liujun;He Yongyi;Li Yanguo
出处
《印制电路信息》
2018年第A02期177-185,共9页
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