摘要
简要介绍了电子封装用环氧树脂材料的特性和组成 ,论述了其增韧、导热、耐热、阻燃和降低内应力等方面的研究状况 ,对新型电子封装用液晶环氧树脂、脂环式环氧树脂、纳米改性环氧树脂、绿色封装材料及面向系统封装的高分子材料改性技术进行了探讨。
Introduce the character and composition of epoxy resins for electronic packaging.Discuss the research on improvement of toughness,heat conduction,heat resistant, fire resistant and stress reduction.Indicate the development of improved epoxy resins for electronic packaging.
出处
《电子工艺技术》
2001年第6期238-241,共4页
Electronics Process Technology
