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Oxygen Recovery in Hf Oxide Films Fabricated by Sputtering

Oxygen Recovery in Hf Oxide Films Fabricated by Sputtering
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摘要 The chemical structure of ultrathin Hf oxide films (〈 10 nm) fabricated by a standard sputtering method is investigated using x-ray spectroscopy and Rutherford backseattering spectroscopy. According to the experiments, oxygen species are impacted to the HfO2/Si interface during the initial sputtering, and then released back to the upper HfO2 region driven by the oxygen concentration grads. A vacuum annealing can greatly enhance this recovery process. Additionally, significant SiO2 reduction in the interface is observed after the vacuum annealing for the thick HfO2 films in our experiment. It might be an effective method to confine the interracial layer thickness by sputtering thick HfO2 in no-oxygen ambient. The chemical structure of ultrathin Hf oxide films (〈 10 nm) fabricated by a standard sputtering method is investigated using x-ray spectroscopy and Rutherford backseattering spectroscopy. According to the experiments, oxygen species are impacted to the HfO2/Si interface during the initial sputtering, and then released back to the upper HfO2 region driven by the oxygen concentration grads. A vacuum annealing can greatly enhance this recovery process. Additionally, significant SiO2 reduction in the interface is observed after the vacuum annealing for the thick HfO2 films in our experiment. It might be an effective method to confine the interracial layer thickness by sputtering thick HfO2 in no-oxygen ambient.
作者 蒋然 李子峰
机构地区 School of Physics
出处 《Chinese Physics Letters》 SCIE CAS CSCD 2009年第5期195-198,共4页 中国物理快报(英文版)
基金 Supported by the China Postdoctoral Science Foundation under Grant No 20080431176, and the Shandong Special Fund for Postdoctoral Innovative Project (No 200702027).
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