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Study of the Preparation Technology and Mechanics of the Compound Temperature-Humidity Sensor 被引量:1

Study of the Preparation Technology and Mechanics of the Compound Temperature-Humidity Sensor
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摘要 The development and character of compound temperature-humidity sensor were discussed in this study.The design of sampling,control and output unit of temperature-humidity sensor as well as their manufacture method and character were studied in detail.The relationship between components of humidity resistance materials and negative temperature coefficient ( NTC) thermistor materials in sampling unit of compound sensor and character of electrical resistance and temperature was obtained.Couples of character curves of compound temperature-humidity sensor and data of materials of sampling unit were shown in this paper too. The development and character of compound temperature-humidity sensor were discussed in this study. The design of sampling, control and output unit of temperature-humidity sensor as well as their manufacture method and character were studied in detail. The relationship between components of humidity resistance materials and negative temperature coefficient (NTC) thermistor materials in sampling unit of compound sensor and character of electrical resistance and temperature was obtained. Couples of character curves of compound temperature-humidity sensor and data of materials of sampling unit were shown in this paper too.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2006年第A03期375-376,共2页 Rare Metal Materials and Engineering
关键词 compound temperature-humidity sensor compensation of humidity embedded system network output compound temperature-humidity sensor compensation of humidity embedded system network output
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参考文献3

  • 1Hitachi Manufacture Co. Ltd. Japanese Patent. JP58105046[P]. 被引量:1
  • 2Shinyeikaisha Co.Ltd. Humidity Sensor with Temperature Compensation Thermistor[R]. C8-TM3 RHU-215. 被引量:1
  • 3Zhou D X, Li B R, Zhang X L. Semiconducting Ceramics and Their Applications[M]. Wuhan: Huazhong University of Science and Technology Press, 1991. 被引量:1

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