摘要
采用直流电沉积法制备了低轮廓电解铜箔,在仅以明胶作为添加剂的情况下研究了钛基体(阴极)表面粗糙度、电流密度、硫酸质量浓度、铜离子质量浓度、电解液温度等工艺参数对铜箔表面形貌及粗糙度的影响。确定最佳的工艺条件为:钛基体表面粗糙度(Rz)1~2μm,电流密度4.0 A/dm^(2),硫酸100 g/L,铜离子60 g/L,电解液温度37°C。所得铜箔表面形貌良好,粗糙度(Rz)小于1.8μm。
Low-profile electrolytic copper foils were prepared by direct-current electrodeposition with only gelatin as an additive.The effects of some process conditions such as surface roughness of titanium substrate(i.e.cathode),current density,mass concentrations of sulfuric acid and copper ions,and electrolyte temperature on the surface morphology and roughness of the electrodeposited copper foil were studied.The optimal process conditions were determined as follows:surface roughness(Rz)of titanium substrate 1-2μm,current density 4.0 A/dm^(2),sulfuric acid 100 g/L,copper ions 60 g/L,and electrolyte temperature 37℃.The copper foil electrodeposited under the optimized conditions exhibited good surface morphology with a roughness(Rz)of lower than 1.8μm.
作者
凌羽
张少强
卢伟伟
徐鹏
朱倩倩
胡浩
宋克兴
杨祥魁
朱义刚
LING Yu;ZHANG Shaoqiang;LU Weiwei;XU Peng;ZHU Qianqian;HU Hao;SONG Kexing;YANG Xiangkui;ZHU Yigang(School of Chemistry and Chemical Engineering,Henan University of Science and Technology,Luoyang 471023,China;Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology,Luoyang 471023,China;School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Shandong Jinbao Electronics Co.,Ltd.,Yantai 265400,China)
出处
《电镀与涂饰》
CAS
北大核心
2023年第20期11-20,共10页
Electroplating & Finishing
基金
国家重点研发计划项目(2021YFB3400800)。
关键词
电解铜箔
直流电沉积
钛基体
电解液成分
温度
表面形貌
粗糙度
electrolytic copper foil
direct-current electrodeposition
titanium substrate
electrolyte composition
temperature
surface topography
roughness
